A surfacing material that can provide improved UV resistance while providing good surface properties. The surfacing material includes a resin layer formed from a curable resin composition containing: (A) one or more cycloaliphatic epoxy resin(s), each having two or more epoxy groups per molecule; (B) an epoxy-amine adduct having two or more epoxy groups per molecule and obtained by a reaction of (i) an epoxy compound having two or more alicyclic epoxy groups per molecule with (ii) an amine compound having two or more amino groups per molecule; (C) a curing agent and/or a catalyst; (D) ceramic microspheres; and (E) a flow control agent in the form of inorganic particles, which are not ceramic microspheres.

The present invention provides: nanoparticles including a compound that includes porous silica and at least one high-atom selected from the group consisting of gadolinium atoms, iodine atoms, gold atoms, silver atoms, and platinum atoms; and a pharmaceutical composition for radiation treatment, useful for treatment of solid tumors, etc., and including these nanoparticles and a pharmaceutically acceptable carrier.

Provided is an RF heat dissipation plastic. The heat dissipation plastic according to one embodiment of the present invention is implemented by including: a polymer matrix comprising a base resin; and hollow first fillers dispersed in the polymer matrix. Accordingly, the RF heat dissipation plastic has the advantageous effect of simultaneously exhibiting low permittivity and excellent mechanical strength due to the hollow fillers included therein. In addition, despite the low permittivity and excellent mechanical strength designed for the RF heat dissipation plastic, the RF heat dissipation plastic exhibits excellent heat dissipation performance due to non-hollow fillers included therein, which exhibit heat dissipation performance. According to the present invention, the RF heat dissipation plastic exhibiting the low permittivity and the excellent mechanical strength and heat dissipation performance can minimize performance degradation or functional loss of a repeater cabinet which may be affected by transmission and reception of high-frequency band signals according to permittivity, and thus can be widely applied to various products across all industries.

Provided is an RF heat dissipation plastic. The heat dissipation plastic according to one embodiment of the present invention is implemented by including: a polymer matrix comprising a base resin; and hollow first fillers dispersed in the polymer matrix. Accordingly, the RF heat dissipation plastic has the advantageous effect of simultaneously exhibiting low permittivity and excellent mechanical strength due to the hollow fillers included therein. In addition, despite the low permittivity and excellent mechanical strength designed for the RF heat dissipation plastic, the RF heat dissipation plastic exhibits excellent heat dissipation performance due to non-hollow fillers included therein, which exhibit heat dissipation performance. According to the present invention, the RF heat dissipation plastic exhibiting the low permittivity and the excellent mechanical strength and heat dissipation performance can minimize performance degradation or functional loss of a repeater cabinet which may be affected by transmission and reception of high-frequency band signals according to permittivity, and thus can be widely applied to various products across all industries.

Provided is an RF heat dissipation plastic. The heat dissipation plastic according to one embodiment of the present invention is implemented by including: a polymer matrix comprising a base resin; and hollow first fillers dispersed in the polymer matrix. Accordingly, the RF heat dissipation plastic has the advantageous effect of simultaneously exhibiting low permittivity and excellent mechanical strength due to the hollow fillers included therein. In addition, despite the low permittivity and excellent mechanical strength designed for the RF heat dissipation plastic, the RF heat dissipation plastic exhibits excellent heat dissipation performance due to non-hollow fillers included therein, which exhibit heat dissipation performance. According to the present invention, the RF heat dissipation plastic exhibiting the low permittivity and the excellent mechanical strength and heat dissipation performance can minimize performance degradation or functional loss of a repeater cabinet which may be affected by transmission and reception of high-frequency band signals according to permittivity, and thus can be widely applied to various products across all industries.

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

Shapeable composites and methods of use and manufacturing arc described herein. The shapeable composites may include a polymer and a functional filler, e.g., the functional filler present in an amount greater than or equal to 40% by weight, based on the total weight of the shapeable composite. The shapeable composite may be a foam composite having a viscoelasticity, such that the shapeable composite is configured to be reshaped.

Shapeable composites and methods of use and manufacturing arc described herein. The shapeable composites may include a polymer and a functional filler, e.g., the functional filler present in an amount greater than or equal to 40% by weight, based on the total weight of the shapeable composite. The shapeable composite may be a foam composite having a viscoelasticity, such that the shapeable composite is configured to be reshaped.

The present invention provides multifunctional particulates that release one or more functional compounds in response to environmental triggers and whose external surface modification imparts secondary functionalities to a selected coating composition. For example, disclosed are hydrophobic particles having a smart release mechanism for anticorrosion compounds that release the anticorrosion compounds upon exposure to the local pH changes induced by corrosion processes. Formulations are disclosed for multifunctional smart particles having antimicrobial effects and protections as well.