A thermoplastic elastomer composition including components (A), (B1), (B2), and (C) below. A composite molded body composed of the thermoplastic elastomer composition. A thermoplastic elastomer composition with which a composite molded body excellent in terms of sliding performance, a fusion bonding capability, and fusion bonding durability can be formed and a composite molded body composed of the thermoplastic elastomer composition can be provided. Component (A): styrene elastomer Component (B1): crystalline polypropylene Component (B2): amorphous polypropylene Component (C): silicone lubricant

The present invention relates to a method for producing foam and foam produced thereby. The method for producing foam includes a step for producing foam by kneading and injection molding a first extrusion product and a second extrusion product, wherein the first extrusion product is obtained by extruding a first composition including an aromatic vinyl-based resin, and the second extrusion product is obtained by extruding a second composition including a polyamide resin and a foaming agent.

The present invention relates to a method for producing foam and foam produced thereby. The method for producing foam includes a step for producing foam by kneading and injection molding a first extrusion product and a second extrusion product, wherein the first extrusion product is obtained by extruding a first composition including an aromatic vinyl-based resin, and the second extrusion product is obtained by extruding a second composition including a polyamide resin and a foaming agent.

Methods for making a semiconductor device using an improved BARC (bottom anti-reflective coating) are provided herein. The improved BARC comprises a polymer formed from at least a styrene monomer having at least one or two hydrophilic substituents. The monomer(s) and substituents can be varied as desired to obtain a balance between film adhesion and wet etch resistance. Also provided is a semiconductor device produced using such methods.

Methods for making a semiconductor device using an improved BARC (bottom anti-reflective coating) are provided herein. The improved BARC comprises a polymer formed from at least a styrene monomer having at least one or two hydrophilic substituents. The monomer(s) and substituents can be varied as desired to obtain a balance between film adhesion and wet etch resistance. Also provided is a semiconductor device produced using such methods.

An overmolded thermoplastic article includes a substrate portion molded from a thermoplastic resin compound and an overmold portion molded from a thermoplastic elastomer compound. The thermoplastic resin compound includes thermoplastic polymer resin. The thermoplastic elastomer compound includes thermoplastic elastomer and polysiloxane as a mold release agent, and is free of wax. The overmold portion is bonded onto the substrate portion with a peel strength at least comparable to that of an overmolded thermoplastic elastomer compound containing wax as a mold release agent instead of the polysiloxane. Undesirable effects observed with the use of wax as a mold release agent in overmolded thermoplastic elastomer compounds such as blooming and ease of scratching/marring can be reduced, while desirable properties such as silky feel of the surface of the overmold portion and good bonding of the overmold portion onto the substrate portion can be at least maintained.

An overmolded thermoplastic article includes a substrate portion molded from a thermoplastic resin compound and an overmold portion molded from a thermoplastic elastomer compound. The thermoplastic resin compound includes thermoplastic polymer resin. The thermoplastic elastomer compound includes thermoplastic elastomer and polysiloxane as a mold release agent, and is free of wax. The overmold portion is bonded onto the substrate portion with a peel strength at least comparable to that of an overmolded thermoplastic elastomer compound containing wax as a mold release agent instead of the polysiloxane. Undesirable effects observed with the use of wax as a mold release agent in overmolded thermoplastic elastomer compounds such as blooming and ease of scratching/marring can be reduced, while desirable properties such as silky feel of the surface of the overmold portion and good bonding of the overmold portion onto the substrate portion can be at least maintained.

The present invention provides a composition for a gel polymer electrolyte, the composition including: a first oligomer represented by Formula 1; a second oligomer including a first repeating unit which is represented by Formula 2a and derived from a styrene monomer; a polymerization initiator; a lithium salt; and a non-aqueous solvent, a gel polymer electrolyte prepared using the same, and a lithium secondary battery.

The present invention provides a composition for a gel polymer electrolyte, the composition including: a first oligomer represented by Formula 1; a second oligomer including a first repeating unit which is represented by Formula 2a and derived from a styrene monomer; a polymerization initiator; a lithium salt; and a non-aqueous solvent, a gel polymer electrolyte prepared using the same, and a lithium secondary battery.

A thermoplastic elastomer compound includes a polyolefin elastomer blend of at least two different polyolefin elastomers, styrene-ethylene/butylene-styrene block copolymer, and plasticizer. The compound has a Melt Flow Rate (230° C., 2.16 kg) of no less than about 5 g/10 min and a Melt Flow Rate (190° C., 2.16 kg) of no less than about 1 g/10 min. Elastomeric films formed from the compound can be used in place of elastomeric films based on styrene-isoprene-styrene (SIS) block copolymers to make components of disposable hygiene articles.