A plasticizer composition contains a compound according to the following formula (I)

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wherein the radicals R.sub.1, R.sub.2 and R.sub.3 are each independently selected from n-pentyl, 2-methylbutyl and 3-methylbutyl. The plasticizer composition can be used as plasticizer for polymers and a corresponding plastic composition contains the plasticizer composition.

Provided is a method of producing a vinyl chloride-based polymer composite, which includes: forming particle nuclei by bulk polymerizing vinyl chloride-based monomers; producing a vinyl chloride-based polymer by bulk polymerizing vinyl chloride-based monomers in the presence of the particle nuclei; and producing a vinyl chloride-based polymer composite including the vinyl chloride-based polymer and a cellulose-based compound.

Provided is a method of producing a vinyl chloride-based polymer composite, which includes: forming particle nuclei by bulk polymerizing vinyl chloride-based monomers; producing a vinyl chloride-based polymer by bulk polymerizing vinyl chloride-based monomers in the presence of the particle nuclei; and producing a vinyl chloride-based polymer composite including the vinyl chloride-based polymer and a cellulose-based compound.

Provided is a method of producing a vinyl chloride-based polymer composite, which includes: forming particle nuclei by bulk polymerizing vinyl chloride-based monomers; producing a vinyl chloride-based polymer by bulk polymerizing vinyl chloride-based monomers in the presence of the particle nuclei; and producing a vinyl chloride-based polymer composite including the vinyl chloride-based polymer and a cellulose-based compound.

A polyvinyl halide compound has thermal conductivity and includes polyvinyl halide resin, natural or synthetic graphite of flake or spheroid form, and at least 0.5 weight percent of epoxidized vegetable oil. Selection of types and amounts of graphite and epoxidized vegetable oil provide thermal conductivity while other desirable properties of the compound are suitably maintained. The compound can be used for making any end use article that needs flame retardance and good thermal management and is especially useful as a thermally conductive material to replace die cast or extruded aluminum heat sinks in industrial applications, such as LED lighting fixtures.

A polyvinyl halide compound has thermal conductivity and includes polyvinyl halide resin, natural or synthetic graphite of flake or spheroid form, and at least 0.5 weight percent of epoxidized vegetable oil. Selection of types and amounts of graphite and epoxidized vegetable oil provide thermal conductivity while other desirable properties of the compound are suitably maintained. The compound can be used for making any end use article that needs flame retardance and good thermal management and is especially useful as a thermally conductive material to replace die cast or extruded aluminum heat sinks in industrial applications, such as LED lighting fixtures.

A polyvinyl halide compound has thermal conductivity and includes polyvinyl halide resin, natural or synthetic graphite of flake or spheroid form, and at least 0.5 weight percent of epoxidized vegetable oil. Selection of types and amounts of graphite and epoxidized vegetable oil provide thermal conductivity while other desirable properties of the compound are suitably maintained. The compound can be used for making any end use article that needs flame retardance and good thermal management and is especially useful as a thermally conductive material to replace die cast or extruded aluminum heat sinks in industrial applications, such as LED lighting fixtures.

To provide a means which makes it possible to hold a microneedle array without an adhesive sheet and protect tips of microneedles. A foam support sheet for a microneedle array, which has an open cell surface on at least one side, the open cell surface being an arrangement portion for the microneedle array holding the microneedle array with a microneedle side of the microneedle array facing downward; as well as a microneedle array sheet consisting of a microneedle array and a foam support sheet, the foam support sheet having an open cell surface on at least one side, and the microneedle array being arranged on the open cell surface with a microneedle side of the microneedle array facing downward.

To provide a means which makes it possible to hold a microneedle array without an adhesive sheet and protect tips of microneedles. A foam support sheet for a microneedle array, which has an open cell surface on at least one side, the open cell surface being an arrangement portion for the microneedle array holding the microneedle array with a microneedle side of the microneedle array facing downward; as well as a microneedle array sheet consisting of a microneedle array and a foam support sheet, the foam support sheet having an open cell surface on at least one side, and the microneedle array being arranged on the open cell surface with a microneedle side of the microneedle array facing downward.

Disclosed is a heat curable solvent free plastisol composition that exhibits very low volatile organic compound amounts while maintaining high performance characteristics. The present plastisol compositions have solvent substitutes used at amounts up to 15% by weight based on the total composition weight. The solvent substitutes have very low vapor pressures, stable viscosity effects, and are fusible with the plastisol polymers. These solvent substitutes can be used to replace the typical solvents without requiring extensive re-formulation of the plastisol composition. The final plastisol compositions according to the present invention exhibit low VOC measures of less than 0.03 pounds per gallon when measured according to EPA Method 24.