C08L33/08

Low temperature vibration damping pressure sensitive adhesives and constructions

Described are viscoelastic damping materials and constructions which may demonstrate low temperature performance and adhesion and which may be used in making vibration damping composites. Viscoelastic damping materials and constructions may include polymers or copolymers of monomers according to formula I:
CH.sub.2═CHR.sup.1—COOR.sup.2  [I]
wherein R.sup.1 is H, CH.sub.3 or CH.sub.2CH.sub.3 and R.sup.2 is a branched alkyl group containing 12 to 32 carbon atoms.

Low temperature vibration damping pressure sensitive adhesives and constructions

Described are viscoelastic damping materials and constructions which may demonstrate low temperature performance and adhesion and which may be used in making vibration damping composites. Viscoelastic damping materials and constructions may include polymers or copolymers of monomers according to formula I:
CH.sub.2═CHR.sup.1—COOR.sup.2  [I]
wherein R.sup.1 is H, CH.sub.3 or CH.sub.2CH.sub.3 and R.sup.2 is a branched alkyl group containing 12 to 32 carbon atoms.

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

Compositions comprising an acrylic polymer and processes of preparing the same

Composites made of a cross-linked acrylic polymer and an inorganic aggregate and/or mineral, with the cross-linked acrylic polymer being present at a concentration of 5% to 17%, by weight, are disclosed. Processes of preparing the composites are also disclosed.

Compositions comprising an acrylic polymer and processes of preparing the same

Composites made of a cross-linked acrylic polymer and an inorganic aggregate and/or mineral, with the cross-linked acrylic polymer being present at a concentration of 5% to 17%, by weight, are disclosed. Processes of preparing the composites are also disclosed.

Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
11692093 · 2023-07-04 · ·

Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
11692093 · 2023-07-04 · ·

Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

Biocompatible porous materials and methods of manufacture and use
11692075 · 2023-07-04 · ·

Methods and materials used for production of constructs having a porous open or semi-open celled structure. Constructs may include a porous matrix as a base and a biocompatible conformal coating thereon.