The invention relates to the use of a low Tg compatible resin as an adhesive layer for the welding of a thermoplastic composite structure to a thermoplastic or thermoset structure. The invention is especially good for the welding of large parts, such as wind turbine halves and spar caps. A useful thermoplastic composite is one formed by the infusion and curing of long fibers by a reactive acrylic liquid resin system, such as ELIUM® resin systems from Arkema.

The invention relates to the use of a low Tg compatible resin as an adhesive layer for the welding of a thermoplastic composite structure to a thermoplastic or thermoset structure. The invention is especially good for the welding of large parts, such as wind turbine halves and spar caps. A useful thermoplastic composite is one formed by the infusion and curing of long fibers by a reactive acrylic liquid resin system, such as ELIUM® resin systems from Arkema.

The present invention relates to a polyamide resin composition that has excellent mechanical properties and shows excellent results in a UL94 combustion test, and that comprises an aliphatic polyamide (A), a phosphinic acid salt (B) and a phosphazene compound (C), wherein the aliphatic polyamide (A) is contained in an amount of 60 mass % or more and 85 mass % or less in the polyamide resin composition, and the phosphazene compound (C) is contained in an amount of 3 mass % or more and 20 mass % or less in the polyamide resin composition.

The present invention relates to a polyamide resin composition that has excellent mechanical properties and shows excellent results in a UL94 combustion test, and that comprises an aliphatic polyamide (A), a phosphinic acid salt (B) and a phosphazene compound (C), wherein the aliphatic polyamide (A) is contained in an amount of 60 mass % or more and 85 mass % or less in the polyamide resin composition, and the phosphazene compound (C) is contained in an amount of 3 mass % or more and 20 mass % or less in the polyamide resin composition.

A method for producing a modified polytetrafluoroethylene, the method including: polymerizing tetrafluoroethylene in an aqueous medium in which a polymer having units based on a fluorine-free monomer is present. The fluorine-free monomer is a monomer represented by formula (1): CH.sub.2═CR.sup.1-L-R.sup.2, where R.sup.1 is a hydrogen atom or an alkyl group, L is a single bond, —CO—O—*, —O—CO—* or —O—, * is a bonding position to R.sup.2, and R.sup.2 is an alkyl group. To the total amount of tetrafluoroethylene supplied to the polymerization, a proportion of the polymer is from 0.001 to 0.050 mass %.

A method for producing a modified polytetrafluoroethylene, the method including: polymerizing tetrafluoroethylene in an aqueous medium in which a polymer having units based on a fluorine-free monomer is present. The fluorine-free monomer is a monomer represented by formula (1): CH.sub.2═CR.sup.1-L-R.sup.2, where R.sup.1 is a hydrogen atom or an alkyl group, L is a single bond, —CO—O—*, —O—CO—* or —O—, * is a bonding position to R.sup.2, and R.sup.2 is an alkyl group. To the total amount of tetrafluoroethylene supplied to the polymerization, a proportion of the polymer is from 0.001 to 0.050 mass %.

The present disclosure relates to a combination, a composite staining kit and a method for revealing a composite material on a tooth.

The present disclosure relates to a combination, a composite staining kit and a method for revealing a composite material on a tooth.

The present invention provides a resin composition for stereolithography that enables easy stereolithographical fabrication; and that can produce a cured object having desirable strain recovery, desirable toughness, and desirable water resistance. The present invention relates to a resin composition for stereolithography comprising a polymerizable compound (A) whose homopolymer has a glass transition temperature (Tg) of 37° C. or higher; and a photopolymerization initiator (B), and having a tan δ at 37° C. of 0.3 or less after cure.

The present invention provides a resin composition for stereolithography that enables easy stereolithographical fabrication; and that can produce a cured object having desirable strain recovery, desirable toughness, and desirable water resistance. The present invention relates to a resin composition for stereolithography comprising a polymerizable compound (A) whose homopolymer has a glass transition temperature (Tg) of 37° C. or higher; and a photopolymerization initiator (B), and having a tan δ at 37° C. of 0.3 or less after cure.