An object of the present invention is to provide a binder composition in which air unevenness is suppressed and which has excellent upper layer coating properties after being formed as a layer, a compound, a binder layer, an optical laminate, an optical laminate manufacturing method, and an image display device. The binder composition of the present invention is a binder composition containing a binder and a compound having a group represented by Formula (B1) or (B2).

##STR00001##

In Formulae (B1) and (B2), Z represents an aliphatic hydrocarbon group having a fluorine atom or an organosiloxane group.

An iodized aromatic carboxylic acid type pendant-containing polymer is provided. A resist composition comprising the same offers a high sensitivity and is unsusceptible to nano-bridging, pattern collapse or residue formation, independent of whether it is of positive or negative tone.

An iodized aromatic carboxylic acid type pendant-containing polymer is provided. A resist composition comprising the same offers a high sensitivity and is unsusceptible to nano-bridging, pattern collapse or residue formation, independent of whether it is of positive or negative tone.

A resin composition for electromagnetic wave absorber may have large absorbance of electromagnetic wave, small transmittance and reflectance of electromagnetic wave, and small variation of reflectance depending on frequency of electromagnetic wave. An electromagnetic wave absorber may use such a composition. The resin composition may contain 0.1 to 10.0 parts by mass of an electromagnetic wave absorbing material, per 100 parts by mass of a thermoplastic resin, demonstrating an absorbance at 76.5 GHz frequency of 40.0 to 100%, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (A); demonstrating a difference between the maximum and minimum value of reflectance in the range from 70 GHz to 80 GHz frequency of 20.0% or smaller, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (B); and being suited for use as an electromagnetic wave absorber.

A resin composition for electromagnetic wave absorber may have large absorbance of electromagnetic wave, small transmittance and reflectance of electromagnetic wave, and small variation of reflectance depending on frequency of electromagnetic wave. An electromagnetic wave absorber may use such a composition. The resin composition may contain 0.1 to 10.0 parts by mass of an electromagnetic wave absorbing material, per 100 parts by mass of a thermoplastic resin, demonstrating an absorbance at 76.5 GHz frequency of 40.0 to 100%, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (A); demonstrating a difference between the maximum and minimum value of reflectance in the range from 70 GHz to 80 GHz frequency of 20.0% or smaller, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (B); and being suited for use as an electromagnetic wave absorber.

A compound expressed in the following formula (1) ##STR00001##
(where R.sup.1 and R.sup.2 independently denote a hydrogen atom or a methyl group, Y.sup.1 and Y.sup.2 independently denote an alkylene group having a carbon number of 1 to 9, and n.sup.1 and n.sup.2 independently denote an integer of 0 to 3).

A compound expressed in the following formula (1) ##STR00001##
(where R.sup.1 and R.sup.2 independently denote a hydrogen atom or a methyl group, Y.sup.1 and Y.sup.2 independently denote an alkylene group having a carbon number of 1 to 9, and n.sup.1 and n.sup.2 independently denote an integer of 0 to 3).

A molded pulp product including: a pulp, a water- and oil-resistant agent, and a water soluble polymer that does not dissolve in an aqueous medium at 40° C. or lower, wherein a content of the water soluble polymer is 1 to 50% by mass, based on the pulp.

A molded pulp product including: a pulp, a water- and oil-resistant agent, and a water soluble polymer that does not dissolve in an aqueous medium at 40° C. or lower, wherein a content of the water soluble polymer is 1 to 50% by mass, based on the pulp.

The present invention provides a composition capable of reducing adhesion of biofilms and therefore useful for producing a molded body. The composition comprises at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, and a quorum sensing inhibitor (B), and is configured such that a common logarithm log S of solubility of the quorum sensing inhibitor (B) in water of 25° C. is less than 0.1, and Ra.sub.1 is greater than 3.2 MPa.sup.1/2, provided that Ra.sub.1 is a distance between a Hansen solubility parameter of the at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins and a Hansen solubility parameter of the quorum sensing inhibitor (B).