A composition for forming an upper layer film is applied onto a resist film formed using an actinic ray-sensitive or radiation-sensitive resin composition, and includes a resin X and a compound A having a radical trapping group. A pattern forming method includes applying an actinic ray-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, applying the composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, exposing the resist film having the upper layer film formed thereon, and developing the exposed resist film using a developer including an organic solvent to form a pattern.

A polymer electrolyte including a polymerization product of a polymer having an unsaturated functional group at a terminal thereof and a fluoroalkylene chain, and an ion-conductive polymer having an unsaturated functional group at a terminal thereof, wherein the ion-conductive polymer having an unsaturated functional group at a terminal thereof is a polymer represented by Formula 1 or Formula 2, and the polymer having an unsaturated functional group at a terminal thereof and a fluoroalkylene chain is a compound represented by Formula 3, wherein Formulae 1 to 3 are the same as represented in the detailed description of the specification.

A porous film includes a porous base and a porous layer containing particles A disposed at least on one side thereof, wherein the particles A contain a mixture including a polymer formed from a fluorine-containing (meth)acrylate monomer and a polymer formed from a (meth)acrylate monomer having a hydroxyl group or a copolymer including a fluorine-containing (meth)acrylate monomer and a (meth)acrylate monomer having a hydroxyl group, with the (meth)acrylate monomer having a hydroxyl group accounting for more than 2 mass% and 30 mass% or less of all components of the particles A, which account for 100 mass%.

A porous film includes a porous base and a porous layer containing particles A disposed at least on one side thereof, wherein the particles A contain a mixture including a polymer formed from a fluorine-containing (meth)acrylate monomer and a polymer formed from a (meth)acrylate monomer having a hydroxyl group or a copolymer including a fluorine-containing (meth)acrylate monomer and a (meth)acrylate monomer having a hydroxyl group, with the (meth)acrylate monomer having a hydroxyl group accounting for more than 2 mass% and 30 mass% or less of all components of the particles A, which account for 100 mass%.

The present teachings are directed at 1,1-disubstituted alkene monomers (e.g., methylene beta-ketoester monomers), methods for producing the same, polymerizable compositions including a methylene beta-ketoester monomer, and polymers, compositions and products formed therefrom. The monomer preferably is a high purity monomer. In the method for producing the methylene beta-ketoesters of the invention, a beta-ketoester may be reacted with a source of formaldehyde. The methylene beta-ketoester monomers may be used in monomer-based products (e.g., inks, adhesives, coatings, sealants or reactive molding) and polymer-based products (e.g., fibers, films, sheets, medical polymers, composite polymers and surfactants).

The present teachings are directed at 1,1-disubstituted alkene monomers (e.g., methylene beta-ketoester monomers), methods for producing the same, polymerizable compositions including a methylene beta-ketoester monomer, and polymers, compositions and products formed therefrom. The monomer preferably is a high purity monomer. In the method for producing the methylene beta-ketoesters of the invention, a beta-ketoester may be reacted with a source of formaldehyde. The methylene beta-ketoester monomers may be used in monomer-based products (e.g., inks, adhesives, coatings, sealants or reactive molding) and polymer-based products (e.g., fibers, films, sheets, medical polymers, composite polymers and surfactants).

An underfill film material and a method for manufacturing a semiconductor device using the same which enables voidless mounting and favorable solder bonding properties are provided. An underfill material is used which contains an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, the underfill material exhibits non-Bingham fluidity at a temperature ranging from 60° C. to 100° C., a storage modulus G′ measured by dynamic viscosity measurement has an inflection point in an angular frequency region below 10E+02 rad/s, and the storage modulus G′ in the angular frequency below the inflection point is 10E+05 Pa or more and 10E+06 Pa or less. This enables voidless packaging and excellent solder connection properties.

An underfill film material and a method for manufacturing a semiconductor device using the same which enables voidless mounting and favorable solder bonding properties are provided. An underfill material is used which contains an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, the underfill material exhibits non-Bingham fluidity at a temperature ranging from 60° C. to 100° C., a storage modulus G′ measured by dynamic viscosity measurement has an inflection point in an angular frequency region below 10E+02 rad/s, and the storage modulus G′ in the angular frequency below the inflection point is 10E+05 Pa or more and 10E+06 Pa or less. This enables voidless packaging and excellent solder connection properties.

To provide a liquid repellent composition which is excellent in liquid repellency and durability and an article having a liquid repelling film. A liquid repellent composition comprising a copolymer (I) and a copolymer (II), characterized in that the copolymer (I) containing from 65 to 95 mass % of a polymerized unit (a) (referred to as “[a.sub.1]”) and from 1 to 30 mass % of a polymerized unit (b); and the copolymer (II) containing from 25 to 80 mass % of a polymerized unit (a) (referred to as “[a.sub.2]”) and from 1 to 50 mass % of a polymerized unit (c) are contained in an amount of the copolymer (I)/the copolymer (II)=10/90 to 95/5 (mass ratio), and [a.sub.1]−[a.sub.2]≧10 (mass %).

For imparting enhanced water-repellency and oil-repellency properties to substrates compositions comprising blends of (A) one or more ester oligomers and (B) one or more polycarbodiimides. Also methods for applying such compositions and articles treated with such compositions.