A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

[Object] To provide a friction material, which is manufactured by forming a non-asbestos-organic (NAO) friction material composition, used for a disc brake assembled in such as a passenger car, which does not degrade the inhibitory effect of rusting and prevents seizure due to corrosion even if the automotive while the parking brake in operation is left under a high humidity state for a long period of time. [Means to Resolve] A friction material, which is manufactured by forming the NAO friction material composition including a binder, a fiber base material, a friction modifier, a lubricant, a pH adjuster, and a filler, where the friction material composition contains 2-6 weight % of alkali metal salt and/or alkaline earth metal salt as the pH adjuster relative to the total amount of the friction material composition, 1-7 weight % of fibrillated organic fiber as the fiber base material relative to the total amount of the friction material composition, and 0-0.5 weight % of water-repelling component relative to the total amount of the friction material composition.

[Object] To provide a friction material, which is manufactured by forming a non-asbestos-organic (NAO) friction material composition, used for a disc brake assembled in such as a passenger car, which does not degrade the inhibitory effect of rusting and prevents seizure due to corrosion even if the automotive while the parking brake in operation is left under a high humidity state for a long period of time. [Means to Resolve] A friction material, which is manufactured by forming the NAO friction material composition including a binder, a fiber base material, a friction modifier, a lubricant, a pH adjuster, and a filler, where the friction material composition contains 2-6 weight % of alkali metal salt and/or alkaline earth metal salt as the pH adjuster relative to the total amount of the friction material composition, 1-7 weight % of fibrillated organic fiber as the fiber base material relative to the total amount of the friction material composition, and 0-0.5 weight % of water-repelling component relative to the total amount of the friction material composition.

[Object] To provide a friction material, which is manufactured by forming a non-asbestos-organic (NAO) friction material composition, used for a disc brake assembled in such as a passenger car, which does not degrade the inhibitory effect of rusting and prevents seizure due to corrosion even if the automotive while the parking brake in operation is left under a high humidity state for a long period of time. [Means to Resolve] A friction material, which is manufactured by forming the NAO friction material composition including a binder, a fiber base material, a friction modifier, a lubricant, a pH adjuster, and a filler, where the friction material composition contains 2-6 weight % of alkali metal salt and/or alkaline earth metal salt as the pH adjuster relative to the total amount of the friction material composition, 1-7 weight % of fibrillated organic fiber as the fiber base material relative to the total amount of the friction material composition, and 0-0.5 weight % of water-repelling component relative to the total amount of the friction material composition.

Cationic or zwitterionic polymer adhesives, adhesive articles, aqueous polymerizable pre-adhesive reaction mixtures, and methods of preparation that include internal incorporation of a phenolic resin. The aqueous polymerizable pre-adhesive reaction mixtures include one or more cationic (meth)acrylate monomers, one or more low Tg nonionic monomer having a (meth)acryloyl group, optionally one or more anionic (meth)acrylate monomers, and one or more phenolic resins.

Cationic or zwitterionic polymer adhesives, adhesive articles, aqueous polymerizable pre-adhesive reaction mixtures, and methods of preparation that include internal incorporation of a phenolic resin. The aqueous polymerizable pre-adhesive reaction mixtures include one or more cationic (meth)acrylate monomers, one or more low Tg nonionic monomer having a (meth)acryloyl group, optionally one or more anionic (meth)acrylate monomers, and one or more phenolic resins.

Cationic or zwitterionic polymer adhesives, adhesive articles, aqueous polymerizable pre-adhesive reaction mixtures, and methods of preparation that include internal incorporation of a phenolic resin. The aqueous polymerizable pre-adhesive reaction mixtures include one or more cationic (meth)acrylate monomers, one or more low Tg nonionic monomer having a (meth)acryloyl group, optionally one or more anionic (meth)acrylate monomers, and one or more phenolic resins.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.