The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1):

##STR00001##

wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula ##STR00001##
In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C.sub.1-C.sub.20 alkyl group, C.sub.1-C.sub.20 alkenyl group, C.sub.1-C.sub.20 cycloalkyl group, C.sub.1-C.sub.20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.

A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula ##STR00001##
In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C.sub.1-C.sub.20 alkyl group, C.sub.1-C.sub.20 alkenyl group, C.sub.1-C.sub.20 cycloalkyl group, C.sub.1-C.sub.20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.

A resorcinolic novolac resin composition comprising the reaction product of (i) an aldehyde or ketone, and (ii) aralkyl-substituted resorcinol and resorcinol, where the moles of the aralkyl-substituted resorcinol to the total moles of the resorcinol and aralkyl-substituted resorcinol is 0.01:1 to 0.4:1.

A resorcinolic novolac resin composition comprising the reaction product of (i) an aldehyde or ketone, and (ii) aralkyl-substituted resorcinol and resorcinol, where the moles of the aralkyl-substituted resorcinol to the total moles of the resorcinol and aralkyl-substituted resorcinol is 0.01:1 to 0.4:1.

Provided is a modified hydroxy naphthalene novolak resin which is optimal for a photosensitive composition and a resist material having high optical sensitivity, resolution, and alkali developability, and excellent heat resistance and moisture absorption resistance, and the modified hydroxy naphthalene novolak resin includes a structural moiety (I) represented by Structural Formula as a repeating unit: ##STR00001## wherein R.sup.1is any one of a hydrogen atom, a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group; m is 1 or 2; R.sup.2's each independently is any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom; and at least one of the R.sup.1's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group.

Provided is a modified hydroxy naphthalene novolak resin which is optimal for a photosensitive composition and a resist material having high optical sensitivity, resolution, and alkali developability, and excellent heat resistance and moisture absorption resistance, and the modified hydroxy naphthalene novolak resin includes a structural moiety (I) represented by Structural Formula as a repeating unit: ##STR00001## wherein R.sup.1is any one of a hydrogen atom, a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group; m is 1 or 2; R.sup.2's each independently is any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom; and at least one of the R.sup.1's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group.

The invention relates to a composition for the production of foams based on phenolic resin, use thereof, and a process for the production of the composition. For provision of a composition for the production of foams based on phenolic resin, where the said composition delivers improved reaction to fire with, in essence, no alteration of further important foam properties, it is proposed that the composition comprises an alkoxylated novolak, wherein the novolak is produced using phenol, cresol and/or xylenol.

The invention relates to a composition for the production of foams based on phenolic resin, use thereof, and a process for the production of the composition. For provision of a composition for the production of foams based on phenolic resin, where the said composition delivers improved reaction to fire with, in essence, no alteration of further important foam properties, it is proposed that the composition comprises an alkoxylated novolak, wherein the novolak is produced using phenol, cresol and/or xylenol.