The invention relates to a composition for the production of foams based on phenolic resin, use thereof, and a process for the production of the composition. For provision of a composition for the production of foams based on phenolic resin, where the said composition delivers improved reaction to fire with, in essence, no alteration of further important foam properties, it is proposed that the composition comprises an alkoxylated novolak, wherein the novolak is produced using phenol, cresol and/or xylenol.

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

A multifunctional naphthol-based epoxy resin composition which is a reaction product of a) a naphthol which is a reaction product of i) from 1 to 99 weight percent 1-naphthol and ii) from 1 to 99 weight percent 2-naphthol; and b) an epihalohydrin, is disclosed. Also disclosed is a curable composition comprising: a) an epoxy component comprising the multifunctional naphthol-based epoxy resin composition; and b) a hardener component comprising i) a phenolic resin component selected from the group consisting of phenol novolac resins, triphenolalkane phenolic resins, aralkyl phenolic resins, biphenyl phenolic resin, biphenyl aralkyl phenolic resins, substituted naphthalene phenolic resins unsubstituted naphthalene phenolic resins, and combinations thereof; and ii) a phosphorus-containing composition which is the reaction product of an etherified resole with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). The curable composition can be used to prepare prepregs, electrical laminates, printed circuit boards, and printed wiring boards.

A multifunctional naphthol-based epoxy resin composition which is a reaction product of a) a naphthol which is a reaction product of i) from 1 to 99 weight percent 1-naphthol and ii) from 1 to 99 weight percent 2-naphthol; and b) an epihalohydrin, is disclosed. Also disclosed is a curable composition comprising: a) an epoxy component comprising the multifunctional naphthol-based epoxy resin composition; and b) a hardener component comprising i) a phenolic resin component selected from the group consisting of phenol novolac resins, triphenolalkane phenolic resins, aralkyl phenolic resins, biphenyl phenolic resin, biphenyl aralkyl phenolic resins, substituted naphthalene phenolic resins unsubstituted naphthalene phenolic resins, and combinations thereof; and ii) a phosphorus-containing composition which is the reaction product of an etherified resole with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). The curable composition can be used to prepare prepregs, electrical laminates, printed circuit boards, and printed wiring boards.

A multifunctional naphthol-based epoxy resin composition which is a reaction product of a) a naphthol which is a reaction product of i) from 1 to 99 weight percent 1-naphthol and ii) from 1 to 99 weight percent 2-naphthol; and b) an epihalohydrin, is disclosed. Also disclosed is a curable composition comprising: a) an epoxy component comprising the multifunctional naphthol-based epoxy resin composition; and b) a hardener component comprising i) a phenolic resin component selected from the group consisting of phenol novolac resins, triphenolalkane phenolic resins, aralkyl phenolic resins, biphenyl phenolic resin, biphenyl aralkyl phenolic resins, substituted naphthalene phenolic resins unsubstituted naphthalene phenolic resins, and combinations thereof; and ii) a phosphorus-containing composition which is the reaction product of an etherified resole with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). The curable composition can be used to prepare prepregs, electrical laminates, printed circuit boards, and printed wiring boards.

A lignin derivative that is extracted from biomass and is used for rubber reinforcement or for use in a molding material is provided. Such a lignin derivative has a number average molecular weight of 300 to 2,000, and contains a component that is soluble in a polar organic solvent, in an amount of 80% by mass or more. When such a lignin derivative is incorporated, a lignin resin composition, a rubber composition, or a molding material, all of which have excellent low hysteresis loss characteristics, elastic modulus, or tensile properties, can be obtained. Furthermore, when a component that is thermofusible is used as the soluble component, a lignin resin composition, a rubber composition, or a molding material, all of which have superior aforementioned characteristics, can be obtained.

A lignin derivative that is extracted from biomass and is used for rubber reinforcement or for use in a molding material is provided. Such a lignin derivative has a number average molecular weight of 300 to 2,000, and contains a component that is soluble in a polar organic solvent, in an amount of 80% by mass or more. When such a lignin derivative is incorporated, a lignin resin composition, a rubber composition, or a molding material, all of which have excellent low hysteresis loss characteristics, elastic modulus, or tensile properties, can be obtained. Furthermore, when a component that is thermofusible is used as the soluble component, a lignin resin composition, a rubber composition, or a molding material, all of which have superior aforementioned characteristics, can be obtained.

A demulsifier composition comprises an oxyalkylated polybenzoxazine having repeating units of Formula (I): ##STR00001##
wherein R.sub.1 is hydrogen, a C.sub.1-30 alkyl, a C.sub.3-30 cycloalkyl, a C.sub.6-30 aryl, a C.sub.7-30 alkylarylene, a C.sub.7-30 arylalkyl, a C.sub.5-30 heteroaryl, or a C.sub.3-30 heterocycloalkyl; R.sub.2 is a C.sub.1-30 alkyl, a C.sub.3-30 cycloalkyl, a C.sub.6-30 aryl, a C.sub.7-30 alkylarylene, a C.sub.7-30 arylalkyl, a C.sub.5-30 heteroaryl, or a C.sub.3-30 heterocycloalkyl; R.sub.3 is hydrogen or a C.sub.1-10 alkyl; each occurrence of R.sub.4 is independently hydrogen or a C.sub.1-5 alkyl; and p is at least 1.

A demulsifier composition comprises an oxyalkylated polybenzoxazine having repeating units of Formula (I): ##STR00001##
wherein R.sub.1 is hydrogen, a C.sub.1-30 alkyl, a C.sub.3-30 cycloalkyl, a C.sub.6-30 aryl, a C.sub.7-30 alkylarylene, a C.sub.7-30 arylalkyl, a C.sub.5-30 heteroaryl, or a C.sub.3-30 heterocycloalkyl; R.sub.2 is a C.sub.1-30 alkyl, a C.sub.3-30 cycloalkyl, a C.sub.6-30 aryl, a C.sub.7-30 alkylarylene, a C.sub.7-30 arylalkyl, a C.sub.5-30 heteroaryl, or a C.sub.3-30 heterocycloalkyl; R.sub.3 is hydrogen or a C.sub.1-10 alkyl; each occurrence of R.sub.4 is independently hydrogen or a C.sub.1-5 alkyl; and p is at least 1.

A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.

##STR00001##