A description is given of a binder system, intended more particularly for use in a process from the group consisting of polyurethane cold-box processes and polyurethane no-bake processes.

A description is given of a binder system, intended more particularly for use in a process from the group consisting of polyurethane cold-box processes and polyurethane no-bake processes.

A cross-linkable composition along with processes for producing the same, uses for the same and articles made therefrom. The cross-linkable composition includes (A) at least one organic compound that is free of siloxane units having at least two reactive cyanate ester groups

(═“N≡C—O—”) and

(B) at least one cyclosiloxane having the general formula (I)

[R.sub.aR.sub.b.sup.1SiO.sub.2/2].sub.m   (I).

Where R may be identical or different and represents monovalent, SiC-bonded, saturated aliphatic hydrocarbon radicals; where R.sup.1 may be identical or different and represents monovalent, SiC-bonded, halogen- or phosphorus-substituted, aromatic hydrocarbon radicals; where a is 0, 1 or 2, preferably 0 or 1, particularly preferably 0; where b is 0, 1 or 2, preferably 1 or 2, particularly preferably 2; where m is 3, 4 or 5, preferably 3 or 4, particularly preferably 4; and where a+b is 2 and at least three radicals R.sup.1 are present per siloxane molecule (B).

To provide an epoxy resin composition that exhibits excellent low dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, a phenol resin and an epoxy resin for providing the composition, and a method for producing such a resin. A phenol resin containing a dicyclopentenyl group and represented by the following general formula (1): wherein each R.sup.1 independently represents a hydrocarbon group having 1 to 8 carbon atoms; each R.sup.2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; i is an integer of 0 to 2; and n represents the number of repetitions and an average value thereof is a number of 10 to 10.

##STR00001##

A fiber-reinforced polyamide resin composition molded article is characterized by 5 to 50 parts by weight of reinforcing fibers, 40 to 94.9 parts by weight of a polyamide resin composition, and 0.1 to 10 parts by weight of an ammonium salt composed of ammonia and an aliphatic dicarboxylic acid having 6 to 12 carbon atoms, and which is also characterized in that: a weight average fiber length of the reinforcing fibers is 0.4 to 7 mm; the polyamide resin composition comprises a polyamide resin, a second resin having a reactive functional group, and a compound produced by a reaction of the resin and the second resin; and the second resin is dispersed in a form of particles with a number average particle diameter of 10 to 1,000 nm.

A fiber-reinforced polyamide resin composition molded article is characterized by 5 to 50 parts by weight of reinforcing fibers, 40 to 94.9 parts by weight of a polyamide resin composition, and 0.1 to 10 parts by weight of an ammonium salt composed of ammonia and an aliphatic dicarboxylic acid having 6 to 12 carbon atoms, and which is also characterized in that: a weight average fiber length of the reinforcing fibers is 0.4 to 7 mm; the polyamide resin composition comprises a polyamide resin, a second resin having a reactive functional group, and a compound produced by a reaction of the resin and the second resin; and the second resin is dispersed in a form of particles with a number average particle diameter of 10 to 1,000 nm.

The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

##STR00001##

[Object] An object of the present invention is to provide a thermoplastic elastomer composition with excellent heat aging resistance and also excellent hardness and mechanical properties as well as excellent moldability.

[Solution] A thermoplastic elastomer composition (I) including a cross-linked product of an ethylene.α-olefin.nonconjugated polyene copolymer (A) with a phenolic resin cross-linking agent (E), and 360 to 460 parts by mass of a crystalline polyolefin (B), 70 to 140 parts by mass of a softener (C), and 2 to 6 parts by mass of a lubricant (D) (provided that the amount of the copolymer (A) is 100 parts by mass).

A shaped article is formed from a cured rubber composition comprising EPDM and a diene rubber. The shaped article exhibits a coefficient of friction greater than 0.1.

A shaped article is formed from a cured rubber composition comprising EPDM and a diene rubber. The shaped article exhibits a coefficient of friction greater than 0.1.