Patent classifications
C08L61/24
Microencapsulation of organic silanes and their use as self healing materials
The disclosure provides a poly(urea-formaldehyde) microcapsule, which comprises encapsulated in the poly(urea-formaldehyde) microcapsule an organofluorine silane of the general formula (I) A.sub.3C(CA.sub.2).sub.mSiR.sup.1.sub.yX.sub.(3-y) (I), wherein in formula (I) A is either fluorine (F) or hydrogen (H), wherein at least 50% of atoms A are fluorine, X is chloro or a group RO, wherein R is a linear or branched alkyl radical of 1 to 4 carbon atoms, R.sup.1 is a linear, branched or cyclic alkyl group of 1 to 8 carbon atoms, n=0 or 2, y=0 or 1 or 2 and m=0 to 20, encapsulated within the microcapsule. The disclosure also provides self-healing coating compositions comprising such polymeric microcapsules and methods of preventing or slowing corrosion using such coating compositions.
Microencapsulation of organic silanes and their use as self healing materials
The disclosure provides a poly(urea-formaldehyde) microcapsule, which comprises encapsulated in the poly(urea-formaldehyde) microcapsule an organofluorine silane of the general formula (I) A.sub.3C(CA.sub.2).sub.mSiR.sup.1.sub.yX.sub.(3-y) (I), wherein in formula (I) A is either fluorine (F) or hydrogen (H), wherein at least 50% of atoms A are fluorine, X is chloro or a group RO, wherein R is a linear or branched alkyl radical of 1 to 4 carbon atoms, R.sup.1 is a linear, branched or cyclic alkyl group of 1 to 8 carbon atoms, n=0 or 2, y=0 or 1 or 2 and m=0 to 20, encapsulated within the microcapsule. The disclosure also provides self-healing coating compositions comprising such polymeric microcapsules and methods of preventing or slowing corrosion using such coating compositions.
Articles made from lipophilic-rich cellulosic material and methods therefor
The invention relates to systems and techniques for manufacturing articles containing cellulosic material, a tackifier, and a binder, and related processes of making and using the cellulosic articles. In particularly exemplary embodiments, the manufactured articles are door skins, sometimes known as door facings, and doors made from the door skins. The article contains a lipophilic cellulosic material, a tackifier, and a binder.
Articles made from lipophilic-rich cellulosic material and methods therefor
The invention relates to systems and techniques for manufacturing articles containing cellulosic material, a tackifier, and a binder, and related processes of making and using the cellulosic articles. In particularly exemplary embodiments, the manufactured articles are door skins, sometimes known as door facings, and doors made from the door skins. The article contains a lipophilic cellulosic material, a tackifier, and a binder.
Modified urea-formaldehyde binders for non-woven fiber glass mats
A method of forming a binder composition includes providing a urea-formaldehyde resin and combining one or more starch compounds with the urea-formaldehyde resin to form a starch modified urea-formaldehyde resin. The one or more starch compounds may be combined with the urea-formaldehyde resin so that the starch modified urea-formaldehyde resin includes about 1 wt. % to about 10 wt. % of the one or more starch compounds.
Modified urea-formaldehyde binders for non-woven fiber glass mats
A method of forming a binder composition includes providing a urea-formaldehyde resin and combining one or more starch compounds with the urea-formaldehyde resin to form a starch modified urea-formaldehyde resin. The one or more starch compounds may be combined with the urea-formaldehyde resin so that the starch modified urea-formaldehyde resin includes about 1 wt. % to about 10 wt. % of the one or more starch compounds.
STRENGTHENING RESINS FOR PAPER PRODUCTS
Resin compositions, products made therewith, and methods for making such resin compositions and products. The resin composition can include a polyamide-epihalohydrin resin, a cationic styrene maleimide resin, and a urea-formaldehyde resin. The polyamide-epihalohydrin resin can include a reaction product of a polyamidoamine and an epihalohydrin. The cationic styrene maleimide resin can include a reaction product of a styrene maleic anhydride copolymer and an amine compound. The product can include a fiber web and an at least partially cured resin composition. The resin composition, prior to curing, can include a polyamide-epihalohydrin resin, a cationic styrene maleimide resin, and a urea-formaldehyde resin. The polyamide-epihalohydrin resin can include a reaction product of a polyamidoamine and an epihalohydrin. The cationic styrene maleimide resin can include a reaction product of a styrene maleic anhydride copolymer and an amine compound.
STRENGTHENING RESINS FOR PAPER PRODUCTS
Resin compositions, products made therewith, and methods for making such resin compositions and products. The resin composition can include a polyamide-epihalohydrin resin, a cationic styrene maleimide resin, and a urea-formaldehyde resin. The polyamide-epihalohydrin resin can include a reaction product of a polyamidoamine and an epihalohydrin. The cationic styrene maleimide resin can include a reaction product of a styrene maleic anhydride copolymer and an amine compound. The product can include a fiber web and an at least partially cured resin composition. The resin composition, prior to curing, can include a polyamide-epihalohydrin resin, a cationic styrene maleimide resin, and a urea-formaldehyde resin. The polyamide-epihalohydrin resin can include a reaction product of a polyamidoamine and an epihalohydrin. The cationic styrene maleimide resin can include a reaction product of a styrene maleic anhydride copolymer and an amine compound.
Resin composition, cured film, laminated film, and method for manufacturing semiconductor device
[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180 C., and whose production of a volatile portion due to decomposition or the like is small even at high temperatures greater than or equal to 250 C., and whose increase in adhesive force is small even after passage through a heat treatment step, and therefore which allows a base material to be easily peeled off at room temperature when the base material is to be peeled off, and a cured membrane and a laminate film that employ this resin composition. [Solution Means] A resin composition containing a polyimide-based resin and a methylol-based compound, the resin composition being characterized in that the polyimide-based resin has an acid dianhydride residue and a diamine residue, and has as the diamine residue at least a residue of a polysiloxane-based diamine represented by General formula (1) and a residue of an aromatic diamine having a hydroxyl group, and a cured product and a laminate film that employ this resin composition. ##STR00001##
(n is a natural number, and an average value thereof calculated from an average molecular weight of the polysiloxane-based diamine is in a range of 5 to 30. R.sup.1 and R.sup.2 may be individually the same or different, indicating an alkylene group or a phenylene group whose carbon number is 1 to 30. R.sup.3 to R.sup.6 may be individually the same or different, indicating an alkyl group, a phenyl group or a phenoxy group whose carbon number is 1 to 30.)
Resin composition, cured film, laminated film, and method for manufacturing semiconductor device
[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180 C., and whose production of a volatile portion due to decomposition or the like is small even at high temperatures greater than or equal to 250 C., and whose increase in adhesive force is small even after passage through a heat treatment step, and therefore which allows a base material to be easily peeled off at room temperature when the base material is to be peeled off, and a cured membrane and a laminate film that employ this resin composition. [Solution Means] A resin composition containing a polyimide-based resin and a methylol-based compound, the resin composition being characterized in that the polyimide-based resin has an acid dianhydride residue and a diamine residue, and has as the diamine residue at least a residue of a polysiloxane-based diamine represented by General formula (1) and a residue of an aromatic diamine having a hydroxyl group, and a cured product and a laminate film that employ this resin composition. ##STR00001##
(n is a natural number, and an average value thereof calculated from an average molecular weight of the polysiloxane-based diamine is in a range of 5 to 30. R.sup.1 and R.sup.2 may be individually the same or different, indicating an alkylene group or a phenylene group whose carbon number is 1 to 30. R.sup.3 to R.sup.6 may be individually the same or different, indicating an alkyl group, a phenyl group or a phenoxy group whose carbon number is 1 to 30.)