A resin system and methods of making resin system wherein lignosulfonate is added to urea-formaldehyde and melamine-urea-formaldehyde adhesives. Lignosulfonate is added to the resins which improves the performance characteristics of the adhesive while reducing environmental impact by consuming byproducts from other industrial processes. The resin system includes a urea-formaldehyde (UF) resin or melamine-urea-formaldehyde (MUF), prepared in at least two stages wherein the UF resin or MUF resin has a molar ratio (MR) of total moles formaldehyde to total moles urea plus, if present, the one or more melamine compounds of from about 0.25:1 to about 2.50:1, and wherein one or more lignosulfonate compounds are included in an amount of from about 0.1-30 wt. %, based on a total weight of the resin system, and wherein the resin system has a buffer capacity of 2-400 mL of 0.1 N HCl by the ATV Method for a period of time of at least about 20 days at 25° C.

A resin system and methods of making resin system wherein lignosulfonate is added to urea-formaldehyde and melamine-urea-formaldehyde adhesives. Lignosulfonate is added to the resins which improves the performance characteristics of the adhesive while reducing environmental impact by consuming byproducts from other industrial processes. The resin system includes a urea-formaldehyde (UF) resin or melamine-urea-formaldehyde (MUF), prepared in at least two stages wherein the UF resin or MUF resin has a molar ratio (MR) of total moles formaldehyde to total moles urea plus, if present, the one or more melamine compounds of from about 0.25:1 to about 2.50:1, and wherein one or more lignosulfonate compounds are included in an amount of from about 0.1-30 wt. %, based on a total weight of the resin system, and wherein the resin system has a buffer capacity of 2-400 mL of 0.1 N HCl by the ATV Method for a period of time of at least about 20 days at 25° C.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

Disclosed herein is a self-healing material comprising microcapsules comprising a monomeric or oligomeric healing agent, and a catalyst that is able to catalyse the polymerisation of the monomeric or oligomeric healing agent.

Disclosed herein is a self-healing material comprising microcapsules comprising a monomeric or oligomeric healing agent, and a catalyst that is able to catalyse the polymerisation of the monomeric or oligomeric healing agent.

A blended furnish with improved performance characteristics while reducing environmental impact, when applied to a substrate and methods of making and using blended furnish are provided. A composite product using a blended furnish is also provided.

The present invention relates to new uses of condensation resins made from urea, formaldehyde, and CH-acidic aldehydes.

The present invention relates to new uses of condensation resins made from urea, formaldehyde, and CH-acidic aldehydes.

The present invention provides modified urea formaldehyde (UF) resin binder compositions and mineral fiber mats having an emulsion polymer modifier comprising, in copolymerized form, from 5 to 25 wt. % of co polymerized carboxylic acid functional monomers. The emulsion polymers have a measured glass transition temperature (DSC) ranging from −40° C. to 70° C. and a large average particle size. Further, the emulsion polymers comprise less than 30% of the copolymerized acid in neutralized form and do not excessively thicken aqueous compositions containing them. The modified UF resin binder compositions enable good dilution stability in use and high tensile strength in products containing them.