The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ.sub.200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m.Math.K) or higher.

The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ.sub.200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m.Math.K) or higher.

An ion conducting polymer comprising a modified poly(phenylene oxide) is described. In an exemplary modified polymer, a portion of the monomeric units are attached to a sulfonate-substituted arylamino moiety, such as a monovalent derivative of phenoxy aniline trisulfonate (BOATS), to form a monomeric unit with a charged side chain. Ion conducting polymers can also be prepared with polyether-containing side chains. The ion conducting polymer can be used to prepare ion exchange membranes which can be used in a variety of applications, such as in non-aqueous redox flow batteries and related energy storage systems.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are uniformly dispersed in the resin composition. The resin composition includes 2 wt % to 40 wt % of a liquid rubber, 5 wt % to 60 wt % of a polyphenylene ether resin, 3 wt % to 40 wt % of a crosslinker, and 5 wt % to 40 wt % of a phosphorus flame retardant. A structural formula of the phosphorus flame retardant is shown as Formula (I):

##STR00001##

A rubber composition is based on at least one predominant vinylaromatic diene elastomer, having a vinylaromatic content of less than 10%; from 3 to 50 phr of a thermoplastic resin, denoted PPE resin, comprising optionally substituted polyphenylene ether units, the resin having a number-average molecular weight (Mn) of less than 6000 g/mol; from 5 to 60 phr of silica as predominant reinforcing filler; and a crosslinking system. Also disclosed are rubber articles comprising such a composition and in particular tires.

A rubber composition is based on at least one predominant vinylaromatic diene elastomer, having a vinylaromatic content of less than 10%; from 3 to 50 phr of a thermoplastic resin, denoted PPE resin, comprising optionally substituted polyphenylene ether units, the resin having a number-average molecular weight (Mn) of less than 6000 g/mol; from 5 to 60 phr of silica as predominant reinforcing filler; and a crosslinking system. Also disclosed are rubber articles comprising such a composition and in particular tires.

A composition includes particular amounts of a poly(phenylene ether), a poly(phenylene ether-siloxane), or a combination thereof; a polyamide composition, wherein the polyamide composition includes at least one polyamide having an amine end group content of less than 75 milliequivalents per gram; and at least one of a polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier, or a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer impact modifier, or a combination thereof, or an ethylene-propylene-diene monomer-modified polyamide, or a polyamide having an amine end group content of 75 to 140 milliequivalents per gram, as a part of the polyamide composition, or a combination thereof. The composition can be particularly useful for forming various articles.

A composition includes particular amounts of a poly(phenylene ether), a poly(phenylene ether-siloxane), or a combination thereof; a polyamide composition, wherein the polyamide composition includes at least one polyamide having an amine end group content of less than 75 milliequivalents per gram; and at least one of a polystyrene-poly(ethylene-propylene) diblock copolymer impact modifier, or a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer impact modifier, or a combination thereof, or an ethylene-propylene-diene monomer-modified polyamide, or a polyamide having an amine end group content of 75 to 140 milliequivalents per gram, as a part of the polyamide composition, or a combination thereof. The composition can be particularly useful for forming various articles.

A polyphenylene ether-based resin composition includes 25 to 84 mass % of a polyphenylene ether (A), 1 to 20 mass % of a styrene-based thermoplastic elastomer (B), 4 to 25 mass % of a flame retardant (C), and 11 to 30 mass % of a kaolin clay (D) when a total content of these four components is taken as 100 mass %. The (C) component contains, per 100 mass % of the (C) component, 0 to 97 mass % of an organophosphorus flame retardant (C-1) having a 10-mass % reduction temperature 380 to 430° C., and 100 to 3 mass % of an organophosphorus flame retardant (C-2) having a 10-mass % reduction temperature 330 to 360° C. The 10-mass % reduction temperature is determined from a heating loss curve obtained by heating about 10 mg of the (C-1) or (C-2) component from 30° C. to 800° C. at 10° C./min under a nitrogen atmosphere in a TGA measurement apparatus.