A composition including a compatibilized blend of polyamide, polyphenylene ether and a flameproofing agent that synergistically interact such that plaques produced from the composition pass a glow wire ignition temperature test (GWIT) without producing a flame. Advantageously, the flameproofing agent is non-halogenated and the compositions also free of other halogen containing components. In addition, the compositions are free of fillers and are unexpectedly still able to pass the noted tests.

A composition including a compatibilized blend of polyamide, polyphenylene ether and a flameproofing agent that synergistically interact such that plaques produced from the composition pass a glow wire ignition temperature test (GWIT) without producing a flame. Advantageously, the flameproofing agent is non-halogenated and the compositions also free of other halogen containing components. In addition, the compositions are free of fillers and are unexpectedly still able to pass the noted tests.

A composition including a compatibilized blend of polyamide, polyphenylene ether and a flameproofing agent that synergistically interact such that plaques produced from the composition pass a glow wire ignition temperature test (GWIT) without producing a flame. Advantageously, the flameproofing agent is non-halogenated and the compositions also free of other halogen containing components. In addition, the compositions are free of fillers and are unexpectedly still able to pass the noted tests.

An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.

An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.

The present disclosure is directed to provide a reinforced resin composition excellent in mechanical strength at elevated temperatures and a molded product including such a reinforced resin composition. A reinforced resin composition of the present disclosure includes (A) a polyamide; (B) a polyamide; (C) a polyphenylene ether; and (D) an inorganic filler, wherein a mass ratio of the component (C) with respect to 100 parts by mass of a sum of the component (A), the component (B), and the component (C) is from 20 to 50 parts by mass, ΔH.sub.TcMt is 10 J/g or more, and ΔH.sub.MpMt is 35 J/g or less.

The present disclosure is directed to provide a reinforced resin composition excellent in mechanical strength at elevated temperatures and a molded product including such a reinforced resin composition. A reinforced resin composition of the present disclosure includes (A) a polyamide; (B) a polyamide; (C) a polyphenylene ether; and (D) an inorganic filler, wherein a mass ratio of the component (C) with respect to 100 parts by mass of a sum of the component (A), the component (B), and the component (C) is from 20 to 50 parts by mass, ΔH.sub.TcMt is 10 J/g or more, and ΔH.sub.MpMt is 35 J/g or less.

The present disclosure is directed to provide a reinforced resin composition excellent in mechanical strength at elevated temperatures and a molded product including such a reinforced resin composition. A reinforced resin composition of the present disclosure includes (A) a polyamide; (B) a polyamide; (C) a polyphenylene ether; and (D) an inorganic filler, wherein a mass ratio of the component (C) with respect to 100 parts by mass of a sum of the component (A), the component (B), and the component (C) is from 20 to 50 parts by mass, ΔH.sub.TcMt is 10 J/g or more, and ΔH.sub.MpMt is 35 J/g or less.

An object of the present invention is to provide a polyphenylene ether melt extrusion formed body which can be obtained by melt forming without mixing other resin components and has excellent properties such as mechanical strength, and a method for producing the same. The present invention relates to a polyphenylene ether melt extrusion formed body comprising a polyphenylene ether component which has a rearrangement structure having a continuous structure bonded at an ortho-position in a repeating unit continuously bonded at a para-position.

An object of the present invention is to provide a polyphenylene ether melt extrusion formed body which can be obtained by melt forming without mixing other resin components and has excellent properties such as mechanical strength, and a method for producing the same. The present invention relates to a polyphenylene ether melt extrusion formed body comprising a polyphenylene ether component which has a rearrangement structure having a continuous structure bonded at an ortho-position in a repeating unit continuously bonded at a para-position.