Provided is a curable composition that is soluble in various solvents (organic solvents other than highly toxic organic solvents, for example, cyclohexanone) while maintaining excellent low dielectric properties, wherein a film obtained by curing the curable composition has excellent mechanical properties. A curable composition, comprising: a polyphenylene ether having a functional group including an unsaturated carbon bond, which is obtained from raw material phenols including phenols satisfying at least condition 1 (having a hydrogen atom at an ortho position and a para position), and having a slope calculated by a conformation plot of less than 0.6; and at least one of a compound containing at least one maleimide group in one molecule, a triazine-based compound containing at least one thiol group, and crosslinked polystyrene particles.

Provided is a curable composition that is soluble in various solvents (organic solvents other than highly toxic organic solvents, for example, cyclohexanone) while maintaining excellent low dielectric properties, wherein a film obtained by curing the curable composition has excellent mechanical properties. A curable composition, comprising: a polyphenylene ether having a functional group including an unsaturated carbon bond, which is obtained from raw material phenols including phenols satisfying at least condition 1 (having a hydrogen atom at an ortho position and a para position), and having a slope calculated by a conformation plot of less than 0.6; and at least one of a compound containing at least one maleimide group in one molecule, a triazine-based compound containing at least one thiol group, and crosslinked polystyrene particles.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

The present invention provides a radome substrate and a preparation method thereof. The radome substrate includes: 5 to 10 parts of polyphenylene ether resin, 70 to 85 parts of ceramic masterbatch, 10 to 15 parts of hollow microbead masterbatch, 1 to 3 parts of a compatibilizer, and 0.1 to 0.3 parts of a lubricant. The radome substrate prepared according to the method provided in the present invention has a high dielectric constant and stress cracking resistance performance.

The present invention provides a radome substrate and a preparation method thereof. The radome substrate includes: 5 to 10 parts of polyphenylene ether resin, 70 to 85 parts of ceramic masterbatch, 10 to 15 parts of hollow microbead masterbatch, 1 to 3 parts of a compatibilizer, and 0.1 to 0.3 parts of a lubricant. The radome substrate prepared according to the method provided in the present invention has a high dielectric constant and stress cracking resistance performance.

The present invention provides a radome substrate and a preparation method thereof. The radome substrate includes: 5 to 10 parts of polyphenylene ether resin, 70 to 85 parts of ceramic masterbatch, 10 to 15 parts of hollow microbead masterbatch, 1 to 3 parts of a compatibilizer, and 0.1 to 0.3 parts of a lubricant. The radome substrate prepared according to the method provided in the present invention has a high dielectric constant and stress cracking resistance performance.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

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