The present invention provides a resin composition which has excellent handleability and which provides a cured product having excellent toughness and heat resistance. The present invention relates to a thermosetting resin composition including an allyl compound (A) containing at least two or more allyl groups and one or more benzene rings in a molecule, a maleimide compound (B) containing at least two or more maleimide groups in a molecule, a thiol compound (C) containing at least two or more thiol groups in a molecule, and a cyclic compound (D) containing at least two or more hydroxyl groups in a molecule.

The present invention provides a resin composition which has excellent handleability and which provides a cured product having excellent toughness and heat resistance. The present invention relates to a thermosetting resin composition including an allyl compound (A) containing at least two or more allyl groups and one or more benzene rings in a molecule, a maleimide compound (B) containing at least two or more maleimide groups in a molecule, a thiol compound (C) containing at least two or more thiol groups in a molecule, and a cyclic compound (D) containing at least two or more hydroxyl groups in a molecule.

A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.

Provided are a heat-curable maleimide resin composition capable of yielding a cured product with a high glass-transition temperature, excellent dielectric properties and a superior adhesiveness to a metal foil, and being evenly cured with no curing unevenness at the time of curing due to its favorable compatibility with other resins; and an adhesive agent, substrate material, primer, coating material and semiconductor device containing such composition. This heat-curable maleimide resin composition contains (A) a maleimide compound and (B) a reaction promoter.

Provided are a heat-curable maleimide resin composition capable of yielding a cured product with a high glass-transition temperature, excellent dielectric properties and a superior adhesiveness to a metal foil, and being evenly cured with no curing unevenness at the time of curing due to its favorable compatibility with other resins; and an adhesive agent, substrate material, primer, coating material and semiconductor device containing such composition. This heat-curable maleimide resin composition contains (A) a maleimide compound and (B) a reaction promoter.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.