C08L79/085

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

Provided are a heat-curable maleimide resin composition suitable for use in a substrate, and whose cured product has an excellent high-temperature property due to its high glass-transition temperature, an excellent dielectric property and an excellent dimension stability; and an uncured and cured resin films comprised of such composition, and having an excellent handling property. The heat-curable maleimide resin composition contains: (A) a maleimide resin having a number average molecular weight of not lower than 3,000; (B) an organic compound having, in one molecule, at least one allyl group and at least one isocyanuric ring; and (C) a reaction initiator.

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: ##STR00001##
wherein R.sup.1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: ##STR00001##
wherein R.sup.1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

CATHETERS HAVING SHAPED DISTAL PORTIONS, AND ASSOCIATED SYSTEMS AND METHODS

Disclosed herein are aspiration guide catheters having a pre-shaped distal portion configured to deflect away from a longitudinal axis of the catheter, and associated systems and methods. In some embodiments, an aspiration guide catheter includes an inner liner defining a lumen and having a proximal region and a distal region. The catheter further includes a braid of wires over the inner liner, and a wire coiled around the braid over at least a portion of the distal region of the inner liner. At least a portion of the braid over the distal region of the inner liner is configured to deflect away from a longitudinal axis of the proximal region. The catheter can further include an outer sheath over the braid, the wire, and the inner liner.

CATHETERS HAVING SHAPED DISTAL PORTIONS, AND ASSOCIATED SYSTEMS AND METHODS

Disclosed herein are aspiration guide catheters having a pre-shaped distal portion configured to deflect away from a longitudinal axis of the catheter, and associated systems and methods. In some embodiments, an aspiration guide catheter includes an inner liner defining a lumen and having a proximal region and a distal region. The catheter further includes a braid of wires over the inner liner, and a wire coiled around the braid over at least a portion of the distal region of the inner liner. At least a portion of the braid over the distal region of the inner liner is configured to deflect away from a longitudinal axis of the proximal region. The catheter can further include an outer sheath over the braid, the wire, and the inner liner.

Nanocomposite Flame Retardant, Flame Retardant Bismaleimide Resin and Preparation Method Thereof
20230265261 · 2023-08-24 ·

The present application discloses a nanocomposite flame retardant. The nanocomposite flame retardant includes 9.7-9.8 wt % of MXene nanosheets, 72.7-76.5 wt % of bimetallic hydroxide and 13.8-17.5 wt % of cuprous oxide particles. The present disclosure further discloses flame-retardant bismaleimide resin added with the nanocomposite flame retardant and a preparation method of the flame-retardant bismaleimide resin. According to the present disclosure, the flame retardant is prepared from magnesium and aluminum elements, so the production cost of the flame retardant is reduced; and meanwhile, the particle size of the cuprous oxide particles is reduced, the specific surface area of cuprous oxide is increased, the catalytic efficiency of the cuprous oxide per unit mass can be improved, and then the flame-retardant and toxicity-reducing effects of products are improved.