Provided is a bismaleimide compound having a favorable compatibility with other resins and contributing to a higher Tg. The compound is represented by the following formula ##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group having 6 to 200 carbon atoms, Q independently represents a cyclohexane backbone-containing divalent alicyclic hydrocarbon group having 6 to 60 carbon atoms, W represents B or Q, n represents 1 to 100, m represents 0 to 100, repeating units identified by n and m whose bonding pattern may be alternate, block or random are present in any order, and wherein Q is independently represented by the following formula (2): ##STR00002## wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, each of x1 and x2 represents a number of 0 to 4.

Provided is a bismaleimide compound having a favorable compatibility with other resins and contributing to a higher Tg. The compound is represented by the following formula ##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group having 6 to 200 carbon atoms, Q independently represents a cyclohexane backbone-containing divalent alicyclic hydrocarbon group having 6 to 60 carbon atoms, W represents B or Q, n represents 1 to 100, m represents 0 to 100, repeating units identified by n and m whose bonding pattern may be alternate, block or random are present in any order, and wherein Q is independently represented by the following formula (2): ##STR00002## wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, each of x1 and x2 represents a number of 0 to 4.

A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved. ##STR00001##

A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved. ##STR00001##

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

A resin sheet is formed of a resin composition containing a thermosetting component (A), in which the thermosetting component (A) contains a maleimide resin and a thermal diffusion rate of the resin sheet after being thermally cured is 1.25×10.sup.−6 m.sup.2/s or more, a peel strength of the resin sheet after being thermally cured is 2.0 N/10 mm or more.

A resin sheet is made using a resin composition containing a thermosetting component (A) and a thermally conductive filler (C). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0×10.sup.−6 m.sup.2/s or more. When a cross section (P) of the resin sheet taken by cutting the resin sheet in a vertical direction to a surface of the resin sheet is observed in an area (P1), a condition represented by a numerical formula (F1) below is satisfied, the area (P1) being defined by a square whose sides are four times as large as a thickness of the resin sheet and including two surfaces of the resin sheet,

0.25≤Ld/Lt≤1  (F1) where Ld is a vertical length of a filler particle having a largest cross-sectional diameter in the vertical direction of the thermally conductive filler (C), and Lt is a length of the resin sheet.