[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

##STR00001##

[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

##STR00001##

Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:

##STR00001##

Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:

##STR00001##

A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.

A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.

A remoldable bismaleimide resin and application thereof. The preparation method includes blending 2-allylphenyl glycidyl ether and terephthalic acid in acetonitrile, carrying out an esterification reaction under the condition of quaternary ammonium salt as a catalyst to obtain bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate containing a reversible dynamic group; then uniformly mixing bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate and bismaleimide, curing to obtain the re-moldable bismaleimide resin. The prepared re-moldable bismaleimide resin not only has excellent heat resistance and mechanical properties, but also can be remolded under hot pressing conditions. The preparation method of the re-moldable bismaleimide resin has the advantages of wide raw material sources and simple process, and has a wide application prospect in the fields of aerospace, transportation, electronic information, new energy, insulated electrical industry and the like.

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.