[Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit; a polysiloxane; a diazonaphthoquinone derivative a compound generating acid or base when exposed to heat or light; and a solvent.

A binder composition comprising a rust inhibitor having a sulfur atom in the molecule, and a carboxyl group-containing polymer.

A binder composition comprising a rust inhibitor having a sulfur atom in the molecule, and a carboxyl group-containing polymer.

There is provided a composition including a first polymer compound having a photoreactive functional group, a second polymer compound, and an ultraviolet absorber having a benzotriazole skeleton, wherein a content of the ultraviolet absorber is less than 20 parts by mass per 100 parts by mass of a total of the first polymer compound and the second polymer compound.

There is provided a composition including a first polymer compound having a photoreactive functional group, a second polymer compound, and an ultraviolet absorber having a benzotriazole skeleton, wherein a content of the ultraviolet absorber is less than 20 parts by mass per 100 parts by mass of a total of the first polymer compound and the second polymer compound.

The present invention relates to a thermally conductive resin composition containing a resin (A) having a melting point of 40 to 100 C. and an inorganic filler (B), wherein the resin (A) has a weight loss of less than 10% when the resin (A) is stored at 150 C. for 100 hours under an atmosphere. The thermally conductive resin composition of the present invention is suitably used for a thermal interface material (TIM), particularly TIM for a semiconductor module.

The present invention relates to a thermally conductive resin composition containing a resin (A) having a melting point of 40 to 100 C. and an inorganic filler (B), wherein the resin (A) has a weight loss of less than 10% when the resin (A) is stored at 150 C. for 100 hours under an atmosphere. The thermally conductive resin composition of the present invention is suitably used for a thermal interface material (TIM), particularly TIM for a semiconductor module.

[Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit; a polysiloxane; a diazonaphthoquinone derivative; a compound generating acid or base when exposed to heat or light; and a solvent.

[Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit; a polysiloxane; a diazonaphthoquinone derivative; a compound generating acid or base when exposed to heat or light; and a solvent.

A temperature-responsive hydrogel which contains a carboxyl group-bearing polymer and a divalent-metal salt of an organic acid is provided. The carboxyl group-bearing polymer may be a homopolymer of a carboxyl group-bearing monomer or a copolymer of a plurality of monomers including the monomer. A method for producing the temperature-responsive hydrogel involves immersing a carboxyl group-bearing polymer in an aqueous solution of a divalent-metal salt of an organic acid. The concentration of the divalent-metal salt of an organic acid in the aqueous solution may be 50 mM to the saturation concentration. It is possible to provide a temperature-responsive gel having an LCST with no volume phase transition and a method for producing the temperature-responsive gel.