The disclosure relates to porous and non-porous silica capsules (capsules in capsule or core-shell capsules), porous microspheres, as well as their direct phase emulsification process without surfactant and their use, wherein the particles comprise a liposoluble active/payload.

To provide hollow particles configured to be low in dielectric dissipation factor at high frequencies. Hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell, wherein a void ratio of the hollow particles is 50% or more; wherein, as the resin, the shell contains a polymer which contains 91% by mass or more of hydrocarbon monomer units and 50% by mass or more of crosslinkable monomer units; wherein at least a part of the hydrocarbon monomer units are crosslinkable hydrocarbon monomer units; wherein a residual double bond ratio of the polymer is 30.0% or less; and wherein a dielectric dissipation factor of the hollow particles at a frequency of 10 GHz is 3.0010.sup.3 or less.

Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

Functionalized microspheres for being dispersed in matrix materials to reduce the density and weight of the materials may be configured to include a covalently bound surface component which is configured to covalently bond with the matrix material so that when combined with the matrix material a strong, light-weight matrix material may be produced.

To provide hollow particles configured to improve adhesion to resin. Hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell, wherein the shell contains, as the resin, a polymer in which 60% by mass or more of crosslinkable monomer units are contained; wherein the hollow particles have carboxy groups on a surface thereof; and wherein a carboxylic acid amount per unit area is 0.500 mol/m.sup.2 or more, which is obtained from an acid value of the hollow particles and a specific surface area of the hollow particles by the following formula (A): Carboxylic acid amount (mol/m.sup.2)=Acid value (mol/g)/Specific surface area (m.sup.2/g).

A method includes admixing an aqueous polysaccharide solution into an oleaginous base fluid, and adding a divalent ion source to produce one or more polysaccharide microspheres.

Provided are a conductive composite, and a method of manufacturing the conductive composite, the composite comprising nonconductive hollow microspheres and conductive filler which are dispersed in a matrix. The nonconductive hollow microspheres and the conductive filler comprised in the conductive composite may be expanded or deformed by pressurization or thermal treatment.

Hollow microparticles of polyvinyl chloride are disclosed, having low volumetric densities useful for reducing mass per unit volume of polymer or inorganic articles and apparatus having such microparticles compounded into thermoplastic or thermoset polymers. A double emulsion polymerization process is also disclosed as the process to produce the hollow microparticles.

To provide hollow particles excellent in pressure resistance. Hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell, wherein a void ratio is 50% or more, and wherein a residual void ratio measured by a specific press test method is 30% or more.

Functionalized microspheres for being dispersed in matrix materials to reduce the density and weight of the materials may be configured to include a covalently bound surface component which is configured to covalently bond with the matrix material so that when combined with the matrix material a strong, light-weight matrix material may be produced.