A composition comprising; a) at least one homopolymer or copolymer of vinyl acetate; and b) at least one softener.

The present invention provides covered particles wherein insulating layers cover the surfaces of electroconductive particles, and the covered particles are excellent in the adhesion between the surfaces of the electroconductive particles and the insulating layers. The covered particles includes: electroconductive particles in which metal films are formed on the surfaces of core materials, and a triazole-based compound is disposed on the outer surfaces on the sides opposite to the core materials in the metal films; and insulating layers covering the electroconductive particles, and the insulating layers comprise a compound having phosphonium groups.

Resin compositions including (A) a hollow organic polymer particle, (B) an epoxy resin, and (C) a curing agent provide cured products having a superior smear removal properties.

The present disclosure provides a resin composition which comprises: 90 parts by weight of vinyl-containing polyphenylene oxide resin; 35 to 70 parts by weight of chemically synthetic silica; and 10 to 30 parts by weight of spherical inorganic fillers, wherein the spherical inorganic fillers include spherical boron nitride, spherical hollow boron silicate or a combination thereof. The present disclosure also provides an article made from the resin composition, wherein the article includes a prepreg, a resin film, a laminate or a printed circuit board. The resin composition of the invention can make the article made therefrom achieve better peeling strength, dielectric constant, dissipation factor, no weave exposure produced and no stripes of branch-like pattern produced at the laminate edge.

A heat-storage composition includes a resin and a heat storage material. The composition has a viscosity of 100 to 1,000 dPa.Math.s, as measured with a cylinder-type rotational viscometer. The composition also has a storage elastic modulus (G′) of 3 Pa or more at an angular frequency of 1 rad/s, as measured by a dynamic viscoelasticity measurement method at a temperature of 25° C. and at a strain of 0.1%.

An aqueous coating material for synthetic papers includes 26 wt % to 75 wt % of an acrylic emulsion, 2 wt % to 10 wt % of hollow latex microspheres and 26 wt % to 70 wt % of an inorganic ink-absorbing material. Each of the hollow latex microspheres has a particle size between 500 nm and 1100 nm, and includes a hollow core, a buffering layer covering the hollow core, and a shell covering the buffering layer. The aqueous coating material can be applied onto a surface of a synthetic paper substrate and formed into a surface coating layer.

To provide such a resin composition, that even though it contains hollow particles, when it is molded into a molded body, a deterioration in the physical properties of the molded body is suppressed. A resin composition comprising: a thermoplastic elastomer having an acid value of less than 3.0 mgKOH/g, hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell and which contain, as the resin, a polymer in which from 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit is contained in 100 parts by mass of all monomer units, and an acid-modified polyolefin-based resin having an acid value of 3.5 mgKOH/g or more.

A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.

The present invention relates to a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.

A composition comprising; a) at least one homopolymer or copolymer of vinyl acetate; and b) at least one softener.