Patent classifications
C08L2205/20
Thermoplastic composite, method for preparing thermoplastic composite, and injection-molded product
Provided is a thermoplastic composite, a method for preparing a thermoplastic composite, and an injection-molded product. The thermoplastic composite comprises 35-75% by weight of a thermoplastic resin, 5-45% by weight of a non-cellulosic organic fiber, and 5-20%) by weight of hollow glass microspheres, based on 100% by weight of the total weight of the thermoplastic composite.
CURABLE COMPOSITIONS AND RELATED METHODS
Provided are two-component curable compositions and methods thereof. The composition includes a base component comprised of a curable resin and a first compressible filler dispersed therein. The composition further includes a curative component comprised of a curing agent and a second compressible filler dispersed therein. The base and curative components react with each other upon mixing to provide a crosslinked network. When used with automated metering pumps, the compressibility of the base and curing agent components can be matched, allowing for a constant mix ratio despite variability in applied pressure.
HIGHLY COMPLIANT NON-SILICONE PUTTIES AND THERMAL INTERFACE MATERIALS INCLUDING THE SAME
Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.
HOLLOW PARTICLES AND USE THEREOF
Hollow particles having a shell including at least one layer, wherein the at least one layer contains a vinyl-based resin, and contains a phosphorus atom and/or a sulfur atom.
HOLLOW RESIN PARTICLES AND APPLICATION THEREOF
Hollow resin particles, a production process for producing the same and application thereof. The hollow resin particles include a thermoplastic resin shell and a hollow part surrounded by the shell. The thermoplastic resin is a polymer produced from a polymerizable component containing 0.6 to 3.0 wt % of a crosslinkable monomer having at least two polymerizable carbon-carbon double bonds per molecule and 97 to 99.4 wt % of an uncrosslinkable monomer having one polymerizable carbon-carbon double bond per molecule. A blowing agent is encapsulated in the hollow resin particles. The blowing agent contains 50 to 100 wt % of an organic compound having a vapor pressure higher than 100 kPa at 25 C. Further, the encapsulation ratio of the blowing agent ranges from 3 to 13 wt % of the hollow resin particles.
AMPHIPHILIC MOLECULES LAYERS
The disclosure relates to a layer comprising at least one hydrophilic part and at least one hydrophobic part, the layer comprising self-assembled amphiphilic molecules polymerized with each other on both the hydrophilic part and the hydrophobic part of the layer; a detecting device comprising a substrate and the above-mentioned layer; and a liposome, a micelle, transport system for a substance and a biomimetic system comprising the above-mentioned layer. The disclosure also relates to a process for producing a layer, the process comprising: providing amphiphilic molecules; allowing sufficient time for the amphiphilic molecules to self-assemble and form at least one hydrophilic part and at least one hydrophobic part of the layer; polymerizing the self-assembled amphiphilic molecules with each other on both the hydrophilic part and the hydrophobic part of the layer.
Recorded matter, ink for recorded matter, and ink
Recorded matter includes a recording medium and an image on the recording medium. The image comprises a hollow resin including a copolymer of the structure unit represented by the following chemical formula 1 and the structure unit represented by the following chemical formula 2. Also, in an IR spectrum of the image, the image satisfies the following ratio: 3.0Y/X6.0, where X represents the absorbance of the image at the maximum absorption wavelength in a range of from 1,590 to 1,610 cm.sup.1 and Y represents the absorbance of the image at the maximum absorption wavelength in a range of from 1,720 to 1,740 cm.sup.1. ##STR00001##
Blade rub material
One aspect of the disclosure involves a rub material comprising a polymeric matrix and polymer micro-balloon filler in the matrix. In one or more embodiments of any of the foregoing embodiments, the matrix comprises a silicone. In one or more embodiments of any of the foregoing embodiments, the rub material is at least 1.0 mm thick. In one or more embodiments of any of the foregoing embodiments, the silicone is selected from the group consisting of dimethyl- and fluoro-silicone rubbers and their copolymers. In one or more embodiments of any of the foregoing embodiments, the micro-balloons at least locally have a concentration of 5-50% by volume.
Porous carbon hollow spheres and methods for their preparation and use
Methods for preparing porous carbon hollow spheres are disclosed. The method includes contacting one or more polymer hollow spheres with a SiO.sub.2 precursor to form one or more SiO.sub.2-containing polymer hollow spheres; carbonizing the one or more SiO.sub.2-containing polymer hollow spheres to form one or more SiO.sub.2-containing carbon hollow spheres; and removing SiO.sub.2 from the one or more SiO.sub.2-containing carbon hollow spheres to form one or more porous carbon hollow spheres. The prepared porous carbon hollow spheres may be filled with liquid metal salts and treated at elevated temperatures to form filled porous carbon spheres. Methods of filling the porous carbon hollow spheres and compositions that include the filled porous carbon spheres are also disclosed.
RUBBER-BASED SELF-ADHESIVE COMPOUND
The invention relates to a self-adhesive compound consisting of a mixture containing: rubber, particularly natural rubber; at least one adhesive resin where said adhesive resins are present at an amount of 40 to 130 phr; and expanded polymer microbeads.