A thiol-ene polymeric material is disclosed. The material is produced by the photopolymerization of reactants having thiol and olefin moieties. The material can incorporate encapsulated components, including cells. Additionally, the material can be derivatized by reacting the polymeric material with components such as proteins.

A method for making a coating composition by mixing one or more latex polymers and an aliphatic epoxy resin system having an epoxy equivalent weight less than 1000 and being distinct from the one or more latex polymers to provide an aqueous first component, and providing a second component having reactive groups that can react with the one or more epoxy resins. A mixture of the first and second components provides a film-forming curable coating composition that may be used on substrates including cement, cement fiberboard, wood, metal, plastic, ceramic, glass and composites.

A method for making a coating composition by mixing one or more latex polymers and an aliphatic epoxy resin system having an epoxy equivalent weight less than 1000 and being distinct from the one or more latex polymers to provide an aqueous first component, and providing a second component having reactive groups that can react with the one or more epoxy resins. A mixture of the first and second components provides a film-forming curable coating composition that may be used on substrates including cement, cement fiberboard, wood, metal, plastic, ceramic, glass and composites.

The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

A resin blend composition of a polyamide resin and a polyester resin is described, which includes a polyamide resin, a polyester resin and an epoxy resin. The resin blend composition can have improved compatibility between the polyamide resin and the thermoplastic polyester resin, and therefore mechanical properties (strength, bending strength, elasticity, abrasion resistance, impact strength), chemical properties (solvent resistance), thermal resistance, dimensional stability, and paintability.

A resin blend composition of a polyamide resin and a polyester resin is described, which includes a polyamide resin, a polyester resin and an epoxy resin. The resin blend composition can have improved compatibility between the polyamide resin and the thermoplastic polyester resin, and therefore mechanical properties (strength, bending strength, elasticity, abrasion resistance, impact strength), chemical properties (solvent resistance), thermal resistance, dimensional stability, and paintability.

A thiol-ene polymeric material is disclosed. The material is produced by the photopolymerization of reactants having thiol and olefin moieties. The material can incorporate encapsulated components, including cells. Additionally, the material can be derivatized by reacting the polymeric material with components such as proteins.

A thiol-ene polymeric material is disclosed. The material is produced by the photopolymerization of reactants having thiol and olefin moieties. The material can incorporate encapsulated components, including cells. Additionally, the material can be derivatized by reacting the polymeric material with components such as proteins.

A thermoplastic composition based on polyamide and polyketone is described. The thermoplastic composition can have an excellent mechanical strength and dimensional stability. Further, the composition can include a novolac resin and a reinforcing or a bulking filler. The composition can be molded, for example in the form of granules or powder, which is used for manufacturing articles via an injection-molding process.