An aqueous system for forming a coating on a substrate includes a polycarbodiimide having the structure:

##STR00001##

Each of R.sup.1 and R.sup.2 is independently chosen from

##STR00002##

Each n is independently a number from 1 to 20, each m is independently a number from 1 to 100, each Y is independently an alkoxy or polyalkoxy group having (w) oxygen atoms, wherein each w is independently at least 1 and each z is independently a number from 0 to (w1). In addition, x, Y, and a total of said C.sub.nH.sub.2n+1 groups are present in a ratio of from (4 to 5):(0 to 1.5):(0 to 4.5. The aqueous system includes water and a reactive compound having at least two reactive groups independently chosen from OH, NHR.sup.3, NH.sub.2, COOH, and SH, and combinations thereof, wherein R.sup.3 is an alkyl group or aromatic group having 1 to 20 carbon atoms.

This flat conductive plate provided with an insulating film includes a flat conductive plate which is a punched product, and an insulating film which coats at least a part of the flat conductive plate, the insulating film is an electrodeposited film, the insulating film includes a polyamide-imide resin and a fluorine-based resin, an amount of the fluorine-based resin with respect to a total amount of the polyamide-imide resin and the fluorine-based resin is in a range of 72% by mass or more and 95% by mass or less, a relative permittivity at 25? C. is in a range of 2.2 or more and 2.8 or less, and an average film thickness is in a range of 5 ?m or more and 100 ?m or less.

The electrodeposition dispersion of the present invention is an electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the solution including water, a dispersion medium, and a solid component, in which the solid component includes a polyimide-based resin and a fluorine-based resin, the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less, an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and a standard deviation of the particle diameter of the solid component is 250 nm or less.

A polymer-based substrate is proposed, which in particular is electrostatically coatable, wherein the substrate comprises a substrate base body made using a polymeric material and a coating applied to a surface region of the substrate base body, wherein the polymeric material comprises a first polymer, wherein the coating comprises a matrix polymer and an additive which is dispersed in the matrix polymer and reduces the surface resistance of the coating, said additive having a proportion that is selected such that the specific surface resistance of the coating is about 10.sup.10 Ohm or less, and wherein the matrix polymer is selected such that it is compatible with the first polymer.

A water-based electrodeposition dispersion for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water, wherein the polymer particles include polyamic acid having a predetermined structural unit, and a volume-based median diameter (D.sub.50) of the polymer particles is 0.08 m to 0.7 m.

Pigment based inks are provided. The inks include a non-polar carrier fluid; and a surface-functionalized pigment particle including a nitrogen-inked moiety to the surface of the pigment particle through a nitrogen link at one end of the nitrogen-linked moiety and a segment copolymer having at least two blocks attached at another end, the pigment particle suspended in the non-polar carrier fluid. A combination of an electronic display and an electronic ink employing the pigment and a process for making the pigment-based inks are also provided.

This insulated flat conductive wire includes: a flat conductive wire having an aspect ratio a/b of 12 or more, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof; and an insulating film which consists of a polyamide-imide resin or a polyimide resin and coats the flat conductive wire, wherein the insulating film has a film thickness t1 of 10 m or more at a center portion of the long side of the rectangular cross-section, and the insulating film has a film thickness ratio t1/t2 of 0.80 to 1.35, and wherein the film thickness ratio t1/t2 is a ratio of the film thickness t1 at the center portion of the long side to a film thickness t2 at an edge portion of the long side of the rectangular cross-section.

Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100 C. and D.sub.(S-P) represented by a formula (1) satisfying a relationship of D.sub.(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 1010.sup.4 to 3010.sup.4 or a number-average molecular weight of the polyamide-imide is 210.sup.4 to 510.sup.4.

D.sub.(S-P)=[(dD.sup.SdD.sup.P).sup.2+(dP.sup.SdP.sup.P).sup.2+(dH.sup.SdH.sup.P).sup.2].sup.1/2(1)

A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.

A method of applying at least one coating of at least one electrically insulating polymer to an applicator for currents, especially HF currents in surgery, the coating is produced by electrophoretic deposition from a suspension of the polymer in at least one organic solvent, wherein the applicators thus coated are especially clamps, pairs of tweezers or pairs of scissors which are used in the bipolar application technique of HF surgery. Polymers used are especially thermoplastic polymers, such as thermoplastic fluoropolymers, and more particularly polychlorotrifluoroethylene (PCTFE) or ethylene chlorotrifluoroethylene (ECTFE).