Provided is a flaky titanate that exhibits a high weathering resistance while at the same time having the ability to endow a coating film with a silky feeling having a shading feeling and a strong luster feeling, and a method for the production thereof suitable at least for inexpensive industrial production. The flaky titanate contains a basic organic compound wherein the content of basic functional groups thereof is not more than 2.4%, and provides a coating film having a goniospectrophotometric color measured value ΔL* of at least 150. The method for producing a flaky titanate contains a step of classifying a flaking titanate having a basic organic compound at the surface and/or in interlayer position, to bring (D90−D10)/D50 in the volume particle size distribution to 1.5 or less.

To provide a liquid material which can only adjust transparency by applying on a part of a zirconia crown having high transparency, without coloring. The present disclosure provides an opaque imparting liquid used for a prosthesis device cut and machined from a dental zirconia for cutting and machining, comprising; (a) 10 to 39 wt. % of a water-soluble aluminum compound and/or a water-soluble lanthanum compound, (b) 60 to 89 wt. % of water, and (c) 1 to 20 wt. % of an organic solvent.

To provide a liquid material which can only adjust transparency by applying on a part of a zirconia crown having high transparency, without coloring. The present disclosure provides an opaque imparting liquid used for a prosthesis device cut and machined from a dental zirconia for cutting and machining, comprising; (a) 10 to 39 wt. % of a water-soluble aluminum compound and/or a water-soluble lanthanum compound, (b) 60 to 89 wt. % of water, and (c) 1 to 20 wt. % of an organic solvent.

Provided is a cationic electrodeposition coating composition having good anti-cratering performance. A cationic electrodeposition coating composition comprising a coating film-forming resin (A), a metal compound (B) containing a trivalent metal element, and a silicone compound (C), wherein a content of the metal compound (B) is 0.03 parts by mass or more and less than 4 parts by mass in terms of a metal element based on 100 parts by mass of a resin solid content of the coating film-forming resin (A), and a content of the silicone compound (C) is 0.005 parts by mass or more and 4.5 parts by mass or less based on 100 parts by mass of the resin solid content of the coating film-forming resin (A).

Provided is a cationic electrodeposition coating composition having good anti-cratering performance. A cationic electrodeposition coating composition comprising a coating film-forming resin (A), a metal compound (B) containing a trivalent metal element, and a silicone compound (C), wherein a content of the metal compound (B) is 0.03 parts by mass or more and less than 4 parts by mass in terms of a metal element based on 100 parts by mass of a resin solid content of the coating film-forming resin (A), and a content of the silicone compound (C) is 0.005 parts by mass or more and 4.5 parts by mass or less based on 100 parts by mass of the resin solid content of the coating film-forming resin (A).

A coating composition for a heat exchanger tube including vanadium (V), a flux, and a binder, wherein the vanadium is included in an amount of 28 to 38 parts by weight with respect to 100 parts by weight of the composition, and a coating method of a heat exchanger tube using the same are provided.

There is provided a non-oriented electrical steel sheet that includes a base metal steel sheet and an insulating coating film that is formed on a surface of the base metal steel sheet, wherein the insulating coating film mainly contains metal phosphate, organic resin, and water-soluble organic compound, the metal phosphate contains at least aluminum as a metallic element, the organic resin has an SP value being within a range of 18.0 (MPa).sup.0.5 or more to less than 24.0 (MPa).sup.0.5, the water-soluble organic compound has an SP value being within a range of 19.0 (MPa).sup.0.5 or more to less than 35.0 (MPa).sup.0.5, and when measurement by X-ray diffractometry is performed on the insulating coating film, a degree of crystallinity of aluminum phosphate calculated from a peak from the metal phosphate is within a range of 0.5 to 5.0%.

There is provided a non-oriented electrical steel sheet that includes a base metal steel sheet and an insulating coating film that is formed on a surface of the base metal steel sheet, wherein the insulating coating film mainly contains metal phosphate, organic resin, and water-soluble organic compound, the metal phosphate contains at least aluminum as a metallic element, the organic resin has an SP value being within a range of 18.0 (MPa).sup.0.5 or more to less than 24.0 (MPa).sup.0.5, the water-soluble organic compound has an SP value being within a range of 19.0 (MPa).sup.0.5 or more to less than 35.0 (MPa).sup.0.5, and when measurement by X-ray diffractometry is performed on the insulating coating film, a degree of crystallinity of aluminum phosphate calculated from a peak from the metal phosphate is within a range of 0.5 to 5.0%.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.