Provided is a hard coating film for foldable displays that does not form creases or cracks in the folding portion, and that is also excellent in reducing iridescent colors (interference mottling) caused by fine cracks in an easy-to-adhere resin layer or other layers. The hard coating film for foldable displays contains a polyester film having a thickness of 10 to 80 μm, an easy-to-adhere resin layer, and a hard coating layer, the easy-to-adhere resin layer and the hard coating layer being stacked in this order on at least one surface of the polyester film, wherein the easy-to-adhere resin layer is a cured product of a composition containing at least one compound selected from the group consisting of titanium compounds and zirconium compounds and a polyester resin, and the polyester film having the easy-to-adhere resin layer stacked thereon but not yet having the hard coating layer stacked thereon satisfies characteristics within specific ranges.

The present invention relates to a peelable coating film having silica particles fixed to a surface thereof, a coating material for hydrophilic-coating-film formation which includes colloidal silica, an alkali metal silicate, and an aqueous medium, and a coating-material set including the coating material for hydrophilic-coating-film formation and a coating material for peelable-coating-film formation including an aqueous dispersion type resin composition.

Provided is an aqueous coating composition which has excellent storage stability and whereby high coating film performance in terms of hardness, water resistance, etc., can be exhibited even when the aqueous coating composition is cured at a relatively low temperature. Disclosed is an aqueous coating composition which contains (A) a resin containing hydroxyl groups and carboxyl groups, (B) a blocked polyisocyanate compound, (C) a phosphate-group-containing compound, and (D) a basic compound, and which has a pH in the range of 7.0-8.2, wherein the basic compound (D) contains a specific quantity of (D1) a basic compound which has an acid dissociation constant (PKa) in the range of 7.0-8.5 and a boiling point in the range of 100-200° C.

The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration. The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25° C. and 20 rpm, of 5-50 mPa.Math.s.

An aqueous surface-treating agent comprising (A) an aqueous emulsion of silicone oil, (B) a silanol-modified polyurethane resin, (C) a silane compound and/or a partial hydrolysate thereof, (D) an aqueous emulsion of a hydrazide and a carbonyl group-containing polyurethane resin, and (E) an aqueous emulsion of a polyurethane resin having a glass transition temperature of −30° C. or lower, and a thermal softening temperature of 70° C. or lower measured by using a flow tester when heated from 40° C. to 150° C. at a heating rate of 5° C./min. The aqueous surface-treating agent contains silicone oil for preventing sticking between products and a silanol-modified polyurethane resin binder having a low hardness and excellent adhesiveness to seal members, and improves the corrosion resistance of an aqueous surface-treating agent for aluminum substrates etc.

A protective film forming agent that, in dicing of a semiconductor wafer, is used to form a protective film on the surface of the semiconductor wafer, can form a protective film that has excellent laser processability, and has excellent solubility of a light-absorbing agent; and a method for producing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light-absorbing agent, a basic compound, and a solvent. The basic compound is an alkylamine, an alkanolamine, an imidazole compound, ammonia, or an alkali metal hydroxide. The light-absorbing agent content of the protective film forming agent is 0.1-10 mass % (inclusive).

A cathodic electrocoating composition having reduced volatile organic compounds includes: an epoxy resin comprising; a film forming binder, and a cross-linking agent; a pigment paste; water; and about 0.01 to about 10 percent by weight of an oxo-alcohol, based on a total weight of the composition, wherein the resin composition is free of glycol ethers.

The present disclosure relates to a composite membrane and a packaging structure. The composite membrane comprises: a carrier layer; and an information layer, wherein the information layer is disposed on one side of the carrier layer along thickness direction of the composite membrane, and the information layer further comprises a light-transmitting layer, a first pattern layer, and a second pattern layer, which are disposed along the thickness direction of the composite membrane, wherein: the first pattern layer is disposed close to the carrier layer; the light-transmitting layer is disposed on one side of the first pattern facing layer away from the carrier layer; the second pattern layer is disposed on one side of the light-transmitting layer facing away from the carrier layer, and the second pattern layer and the first pattern layer present different visual information of one multi-dimensional object.

The present disclosure relates to a composite membrane and a packaging structure. The composite membrane comprises: a carrier layer; and an information layer, wherein the information layer is disposed on one side of the carrier layer along thickness direction of the composite membrane, and the information layer further comprises a light-transmitting layer, a first pattern layer, and a second pattern layer, which are disposed along the thickness direction of the composite membrane, wherein: the first pattern layer is disposed close to the carrier layer; the light-transmitting layer is disposed on one side of the first pattern facing layer away from the carrier layer; the second pattern layer is disposed on one side of the light-transmitting layer facing away from the carrier layer, and the second pattern layer and the first pattern layer present different visual information of one multi-dimensional object.

A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.