A metallic nanoparticle dispersion includes metallic nanoparticles, a liquid carrier and an optional binder, and a silane compound according to Formula I:

##STR00001## wherein R1, R2 and R3 are independently selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, an alkoxy group and an aryloxy group with the proviso that at least one of R1 to R3 represents an alkoxy group or an aryloxy group, L1 represents a divalent linking group including one to 20 carbon atoms, A represents a thiol, a disulfide or a functional moiety comprising at least one thiol or disulfide, having no more than 10 carbon atoms, and n represents 0 or 1.

An epoxy resin composition which is suppressed in curing shrinkage upon being cured to obtain a cured film having low warpage and high adhesion. The epoxy resin composition contains epoxy resin (A), compound (B) represented by formula (1) and nanosilica filler (C). In formula (1), R.sub.1 and R.sub.2 are independently an alkyl group having 1 to 10 carbons or a phenyl group, and X is independently hydrogen or a monovalent organic group, and in one molecule of the compound, at least one of X includes an epoxy group.

##STR00001##

An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 m to 5 m; an organic solvent; and a resin component consisting of a cellulose derivative. A conductor obtained by firing the electrically conductive paste has a film thickness of 30 m or more and a specific resistance of 5.010.sup.6 .Math.cm or less. In this way, the electrically conductive paste can reduce the resistance of the obtained conductor and to increase the amount of current flowing. A wiring board includes a conductor obtained from the electrically conductive paste.

The present invention relates to a matte coating composition comprising an aqueous dispersion of a) polymer particles having an average particle size in the range of from 80 nm to 500 nm; b) polymeric organic crosslinked microspheres having a particle size in the range of from 1 ?m to 20 ?m; c) polyethylene wax particles having a particle size in the range of from 0.3 ?m to 30 ?m; and d) a rheology modifier. The composition of the present invention gives matte finish coatings with excellent burnish resistance.

Display substrates having a hard coat layer on a colorless polyimide substrate are formed from hard coat compositions having certain organic solvents that do not substantially impact the optical and mechanical properties of the colorless polyimide substrate.

A curable composition comprising an epoxy-siloxane oligomer comprising as polymerized units one or more difunctional silane monomers of formula (1) and one or more trifunctional silane monomers of formula (2) in a mole ratio of 95:5 to 10:30

Si(R.sup.1)(R.sup.2)(Y.sub.1).sub.2 (1)

SiR.sup.3(Y.sup.2).sub.3 (2)

wherein R.sup.1, R.sup.2, and R.sup.3 are independently chosen from a C.sub.5-20-aliphatic group comprising an oxirane ring fused to an alicyclic ring, C.sub.1-20-alkyl, C.sub.6-30-aryl group, and a C.sub.5-20-aliphatic group having one or more heteroatoms; each Y.sup.1 and Y.sup.2 is independently chosen from halogen, C.sub.1-4-alkoxy, and OC.sub.1-4-acyl group; wherein at least one of R.sup.1, R.sup.2, and R.sup.3 is a C.sub.5-20-aliphatic group comprising an oxirane ring fused to an alicyclic ring; (b) organic particles having an average diameter of 50 to 250 nm; (c) a reactive carrier having one or more epoxy moieties or oxetane moieties; (d) a curing agent; and (e) one or more organic solvents, and methods of forming cured coatings using such compositions are described.

A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A process for producing nano veneers generally involving: placing a veneer to be treated in a vacuum vessel; adding a nano carbon powder and nano silicon dioxide suspension in the vacuum vessel; reducing the pressure in the vessel over a first period of time; increasing the pressure in the vessel; letting the contents of the vessel rest over a second period of time. The veneer may optionally be subjected to ultrasonic treatment, ultraviolet solidification treatment, or subsequent pressurization treatments to obtain the final nano veneer product. As a result, veneer manufactured using embodiments of the present invention will have the advantages of high strength, wear resistance, pollution resistance, acid and alkali resistance, water segregation and decay resistance.

According to one embodiment, a semiconductor device includes an insulating film. The insulating film includes a first insulating particle, and a second insulating particle. A particle size of at least one of the first insulating particle or the second insulating particle exceeds 0 nm and being not more than 30 nm. An average size of a void between the first insulating particle and the second insulating particle exceeds 0 nm and being not more than 10 nm.

Provided are formulations and processes for obtaining conductive patterns of copper onto a substrate.