Coating compositions that may be used in combination with UV light for sterilization include a polyurethane component and nanoparticles having an average particle size of from about 30 nm to about 400 nm. The nanoparticles absorb light having a wavelength of from about 100 nm to about 290 nm, and are present in an amount of less than about 25 weight percent of total solids in the coating composition.

A silicone mist inhibitor which has an excellent effect of inhibiting silicone mist and provides a composition and a cured product which have excellent storage stability is provided. A silicone mist inhibitor includes at least one selected from organic powder, inorganic powder and inorganic-organic composite powder, wherein the powder has a volume average particle size of 100 to 4000 nm. Further, a solventless silicone composition includes an organopolysiloxane having a viscosity at 25 degrees C. of 25 to 50,000 mPa.Math.s, wherein the solventless silicone composition further includes the aforesaid silicone mist inhibitor in an amount of 0.1 to 10 parts by mass, relative to 100 parts by mass of the organopolysiloxane.

The invention relates to an anti-corrosion and anti-fouling composition, particularly to a protective composition for a marine body, wherein in said composition comprises a copper alloy of the form Cu(M*), wherein M* is at least one metal which is more electronegative than copper, wherein said composition comprises ceramic filler particles in the range of from 0.1 to 20 wt %.

Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 m to 9.0 m, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.

An article has a substrate and a pattern of a dry silver nanoparticle-containing composition comprising at least 20 weight % of one or more (a) polymers, that are cellulosic polymers; (d) silver nanoparticles having a mean particle size of 25-750 nm and present in an amount of 0.1-400 weight %, based on the total weight of the one or more (a) polymers; and (e) carbon black in an amount of 5-50 weight %, based on the total weight of the one or more (a) polymers. Such patterns can have multiple fine lines of any geometric arrangement. The article can have multiple patterns of this type, and each pattern can be electrolessly plated with a suitable metal such as copper to provide electrically-conductive product articles.

[Summary]

The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.

A composition for forming a conductive film contains flat metal particles and a resin. The flat metal particles each have a metal oxide layer in the surface portion thereof. The flat metal particles have a ratio of the thickness of the metal oxide layer to the thickness of the flat metal particle of from 0.010 to 0.300. The thickness of the metal oxide layer is from 0.010 m to 2.000 m. In the method for manufacturing a conductive film, a composition for forming a conductive film is used, the composition containing flat metal particles and a resin. The composition for forming a conductive film is applied to a base material to form a coating film, and then the coating film is irradiated with light to sinter the coating film, thereby obtaining a conductive film. The flat metal particles each have a metal oxide layer in the surface portion thereof.

Provided herein are highly conductive compositions (having a volume resistivity no greater than 110.sup.3 Ohms.Math.cm) using silver flake, powder or suspension in solvent for electromagnetic interference (EMI) applications. This high conductivity will allow the use of very thin films for EMI shielding protection, which in turn will be helpful to reduce package sizes. In some embodiments, the coating composition is applied on the device surface by suitable means, e.g., by an electrostatic spray process, air spray process, ultrasonic spray process, spin coating process, or the like.

The composition of the present invention includes tungsten oxide particle, inorganic particle other than tungsten oxide particle, and a solvent. The inorganic particle is preferably made of a clay mineral. The clay mineral is preferably bentonite, saponite, or mica. The volume median diameter (D.sub.50) of the tungsten oxide particle is preferably 0.01 m or more and 10.0 m or less.