Patent classifications
C09D7/68
INSULATION COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ELECTRICAL STEEL SHEET, AND METHOD FOR MANUFACTURING SAME
An insulation coating composition for an electrical steel sheet according to an exemplary embodiment of the present disclosure contains, with respect to 100 parts by weight of a solid content, 30 to 60 parts by weight of an organic/inorganic composite in which inorganic nanoparticles are substituted in a resin, 15 to 45 parts by weight of a metal phosphate, 10 to 40 parts by weight of kaolin, 1 to 10 parts by weight of an inorganic dispersant, and 0.1 to 5 parts by weight of a carbon structure.
COPPER POWDER AND ELECTRICALLY CONDUCTIVE PASTE, ELECTRICALLY CONDUCTIVE COATING, ELECTRICALLY CONDUCTIVE SHEET, AND ANTISTATIC COATING USING SAME
To provide a copper powder exhibiting a high electric conductivity suitable for a metallic filler used in an electrically conductive paste, a resin for electromagnetic shielding, an antistatic coating, etc., and having excellent uniform dispersibility required for forming a paste so as to inhibit an increase in viscosity due to flocculation. This copper powder 1 forms a branch shape having a plurality of branches through the conglomeration of copper particles 2. The copper particles 2 have a spheroidal shape, with diameters ranging from 0.2 m-0.5 m, inclusive, and lengths ranging from 0.5 m-2.0 m, inclusive. The average particle diameter (D50) of the copper powder 1 in which the spheroidal copper particles 2 have conglomerated is 5.0 m-20 m. By mixing this tree-branch-shaped copper powder 1 into a resin, it is possible to produce an electrically conductive paste, etc., exhibiting excellent electric conductivity, for example.
SILVER PARTICLE SYNTHESIZING METHOD, SILVER PARTICLES, CONDUCTIVE PASTE PRODUCING METHOD, AND CONDUCTIVE PASTE
A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.
Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
FILM
The present invention relates to a film, in particular to a laser writable film, and to substances used therein, and components thereof. The present invention further relates to a method of manufacturing the film, uses thereof and products comprising the film.
PRODUCTION METHOD FOR BASIC ZINC CYANURATE POWDER AND PRODUCTION METHOD FOR RUST-PREVENTIVE PIGMENT COMPOSITION
A method produces a basic zinc cyanurate powder, the amount of a portion thereof which remains in a sieve having a mesh size of 1,000 m being less than 1 mass %. The method includes heating, at 30 to 300 C., a powder-form mixture which is composed of zinc oxide, cyanuric acid, and water, which has a ratio by mole of zinc oxide to cyanuric acid of 2 to 3, and which has a water content of 9 to 18 mass %, in a closed or unclosed state.
SEPARATOR FOR RECHARGEABLE BATTERY AND RECHARGEABLE BATTERY INCLUDING THE SAME
A separator for a rechargeable battery includes a porous substrate and a heat-resistant layer disposed on at least one surface of the porous substrate, wherein the heat-resistant layer includes a compound represented by Chemical Formula 1 or a cross-linked product thereof and a rechargeable lithium battery includes the same.
(R).sub.n1ArOH[Chemical Formula 1]
In Chemical Formula 1, Ar, R, and n1 are the same as described in the detailed description.
METAL-BASE PRINTED CIRCUIT BOARD
A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D.sub.50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 m with an average particle diameter (D.sub.50) of 500 nm to 20 m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.
USE OF GAMMA IRON(III) OXIDE (GAMMA-FE2O3) CONTAINING PARTICLES FOR THE PREVENTION OF BIOFOULING AND/OR GROWTH OF MICROORGANISMS
The present invention relates to the use of gamma iron(III) oxide (-Fe.sub.2O.sub.3) containing particles for the prevention of biofouling and/or growth of microorganisms. Furthermore, it relates to a method for preventing biofouling of a substrate and to a method of imparting biocidal properties to the surface of a substrate.
PRE-FORMULATED POWDER FEEDSTOCK
A powder composition adapted for use in suspension thermal spray coating processes. The powder includes agglomerated and/or non-agglomerated particles having at least one dispersing agent deposited thereon. The composition results in a homogeneous, stable suspension when combined with a liquid carrier for use in suspension thermal spray coating processes.