Patent classifications
C09D7/68
METHOD OF FORMULATING AN ACTIVE ICE-REPULSING NANO-FILLED COATING
A radome surface coating arrangement transparent to radiofrequency (RF) signals, the coating arrangement includes a first coating layer applied to and in physical contact with a radome surface and a second coating layer applied to and in physical contact with the first coating layer. The first coating layer includes nanoparticles capable of being heated by RF signals emitted through the coating arrangement. The second coating layer is a hydrophobic or superhydrophobic coating material devoid of the nanoparticles. The second coating layer covers the first coating layer.
ENCAPSULATION EPOXY RESIN COMPOSITION AND ELECTRONIC DEVICE
An encapsulation epoxy resin composition contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D). The curing accelerator (C) contains an amidine silicate (C1) expressed by the following formula (1):
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Resin composition and application thereof
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 m, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.
Dip-coat binder solutions comprising metal dip-coat powder for use in additive manufacturing
A dip-coat binder solution comprises a metal dip-coat powder and a dip-coat binder. The dip-coat binder solution has a viscosity greater than or equal to 1 cP and less than or equal to 40 cP. The metal dip-coat powder may comprise a stainless steel alloy, a nickel alloy, a copper alloy, a copper-nickel alloy, a cobalt-chrome alloy, a titanium alloy, an aluminum alloy, a tungsten alloy, or a combination thereof. A method of forming a part includes providing a green body part comprising a plurality of layers of print powder, dipping the green body part in a dip-coat binder solution to form a dip-coated green body part, and heating the dip-coated green body part. After dipping, the dip-coated green body part has a surface roughness Ra less than or equal to 10 m.
DYE-EXCHANGED ZEOLITE MARKER
A dye-exchanged zeolite marker wherein the zeolite is characterized by a pores size comprised between 4 and 12 and the dye is an organic cationic molecule, characterized by an amount of dye comprised between 0.05% wt and 1% wt with respect to the zeolite weight, optically active compositions comprising the same dispersed in a polymeric matrix and their use as a detectable marker.
UV CURABLE COATING COMPOSITIONS CONTAINING ALIPHATIC URETHANE ACRYLATE RESINS
The invention provides UV curable coating compositions comprising a synergistic two-component system of aliphatic urethane acrylate resins. The first component is formed by reacting an aliphatic polyisocyanate containing iminooxadiazine dione, isocyanurate, uretdione, urethane, allophanate, biuret, or oxadiazine trione groups with a hydroxyl-functional acrylate. The second component is formed by reacting a multifunctional acrylate with an aliphatic urethane based on alkyl carbomoncycle diisocyanate. The components combine in specific ratios to create coatings with superior hardness, scratch resistance, chemical resistance, and weatherability for automotive applications. Quantifiable structure-property relationships define optimal formulations for specific applications including vehicle headlamp lenses and trim components. Also described are coated articles and methods for their production.
METHODS AND COMPOSITIONS PROVIDING HIGH PERFORMANCE NANOCOMPOSITE LAYERS FOR USE IN PACKAGING APPLICATIONS
This disclosure provides novel nanocomposites having monomodal, bimodal, and multimodal mineral particles dispersed within the polymer matrix to provide high performance nanocomposite barrier layer(s). The nanocomposite barrier layer enhances barrier performance to include moisture, water, and oxygen barrier characteristics used in consumer and industrial packaging applications. Mineral fillers, such as clay nanoparticles combined with micro and colloidal diatomaceous earth, such as calcium carbonate being one example. Bimodal and multi-modal particle combinations can play a significant role in improving intercalation and exfoliation of nanoparticles within the thermoplastic matrix during the compounding and extrusion. The present disclosure includes descriptions of nanocomposites as part of blown films, paper extrusion coatings, and extrusion laminations. The barrier layers may be part of single and multi-layer thermoplastic layers used as films and paper coatings in the range of about 6 to 500 g/m2.
Composite particles for water-based coating compositions
A waterborne coating composition which includes a film-forming binder and composite particles comprising wax and a metal oxide, such as wax encapsulated zinc oxide, provides enhanced mildew resistance.
Encapsulating material for compression molding and electronic part device
An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is 86% or more of the area of the entire region corresponding to the compression-molded body on the chip.
Imide addition-fragmentation agents
A polymerizable composition is described comprising at least one monomer, oligomer, polymer, or a combination thereof comprising ethylenically unsaturated groups; and at least one cyclic imide monomer comprising an , -unsaturated carbonyl. The cyclic imide monomer comprises an imide group and the , -unsaturated carbonyl in a heterocyclic ring wherein the ring comprises at least 6 covalently bonded atoms. Also described are cyclic imide monomers, (e.g. hardcoat) compositions, methods of making a coated substrate, cyclic imide monomers, and methods of making cyclic imide monomers.