C09D7/69

COPPER OXIDE PASTE AND METHOD FOR PRODUCING ELECTRONIC PARTS
20220332958 · 2022-10-20 ·

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

COATING FORMULATION FOR CURTAIN COATING FIBROUS NON-WOVEN MATS

A coated non-woven fibrous mat is disclosed comprising a non-woven precursor mat including a plurality of randomly oriented fibers bound by a precursor binder composition, The non-woven fibrous precursor mat has a first major surface and a second major surface opposite to and having a surface roughness greater than the first surface, defining a thickness therebetween. A coating composition is applied to the second major surface of the non-woven precursor mat and substantially uniformly penetrates 5% to less than 30% of the thickness of the non-woven precursor mat. The coating composition comprises a mineral filler and an organic latex binder composition. The coating composition is applied to the non-woven precursor mat in an amount between 1.0 and 10.0 lbs/100 ft.sup.2.

COMPOSITION FOR FORMING GAS BARRIER FILM, GAS BARRIER FILM AND METHOD FOR PRODUCING SAME

A gas barrier film-forming composition comprising the following components: plate-like particles composed of exfoliated layer substances generated through interlayer exfoliation of layered compound, plate-like particles having average thickness of 0.7 nm to 100 nm, average major-axis length of 100 nm to 100,000 nm, and ratio of (maximum major-axis length/width orthogonal to maximum major-axis length) of 1.0 to 10.0, and containing quaternary ammonium ions each having total carbon atom number of 13 to 45 and one or two C.sub.10-20 alkyl groups, and anionic surfactant having ammonium ion, wherein the amount of each of quaternary ammonium ions and anionic surfactant is more than 0% by mass and 3.0% by mass or less relative to mass of plate-like particles, a water-soluble polymer; and an aqueous medium. The gas barrier film-forming composition, wherein layered compound is ilerite. A formed product comprising a base and a gas barrier film disposed on surface of the base.

COATING COMPOSITIONS FOR HYDROPHOBIC FILMS AND ARTICLES HAVING HYDROPHOBIC SURFACES
20220315775 · 2022-10-06 · ·

This invention relates to a coating composition. The coating composition may include hydrophobized silica particles, a film-forming binder, and a solvent. The hydrophobized silica particles comprise porous silica particles having a pore diameter of about 80 or more which have been treated to form a hydrophobic coating on a surface of the porous silica particles.

ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART DEVICE
20220315793 · 2022-10-06 · ·

An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is 86% or more of the area of the entire region corresponding to the compression-molded body on the chip.

ANTIMICROBIAL COATING COMPOSITION AND METHOD FOR PRODUCING THE SAME
20220315770 · 2022-10-06 · ·

The present invention relates to an antimicrobial coating composition having antiviral activity against coronavirus, the composition comprising: an adhesive having adhesiveness to a surface coated therewith; and a coronavirus antiviral material which is to be attached to the surface by the adhesiveness of the adhesive and exhibits antiviral activity against coronavirus.

Composition, coating method, and multilayer structure

The composition of the present invention includes tungsten oxide particle, inorganic particle other than tungsten oxide particle, and a solvent. The inorganic particle is preferably made of a clay mineral. The clay mineral is preferably bentonite, saponite, or mica. The volume median diameter (D.sub.50) of the tungsten oxide particle is preferably 0.01 μm or more and 10.0 μm or less.

Polarizing plate, liquid crystal panel and display device

The present invention relates to a polarizing plate including: a polarizer; a hard coating layer having a thickness of 10 μm or less formed on one surface side of the polarizer; and an optical laminate including a light-transmitting substrate formed on the other surface side of the polarizer.

CHARGING MEMBER AND ELECTROPHOTOGRAPHIC IMAGING APPARATUSES EMPLOYING THE SAME
20230144220 · 2023-05-11 ·

An example charging member has a surface layer including a binder resin, first particles, and second particles, the first and second particles being dispersed in the binder resin, the first particles include acrylic resin particles having an average particle diameter of about 16 μm to about 35 μm, and the second particles include spherical silica particles having an average particle diameter of about 3 μm to about 10 μm. The content of the first particles is in a range of about 5 parts by weight to about 20 parts by weight and when a mass of the first particles is M1 and a mass of the second particles M2, the condition of 0.2≤M1/(M1+M2)≤0.8 is satisfied.