Nanoparticle ink compositions are disclosed. The nanoparticle ink compositions are printable. The nanoparticle ink compositions include a highly resistive nanoparticle and a conductive nanoparticle in a carrier. Methods of manufacturing microscale assemblies are also disclosed. The methods include printing at least one layer of a nanoparticle ink composition onto a substrate adjacent at least one metallic or conductive electrode. The microscale assemblies form at least one component of a neuromorphic computing chip, a photonic or chemical sensor, or a quantum computation chip. The microscale assemblies exhibit properties of a nanoscale assembly. Switching matrix to produce wide range of circuit configurations is disclosed.

Disclosed are an ink composition, a layer manufactured using the ink composition, an electrophoresis apparatus including the layer, and a display device, the ink composition including (A) a semiconductor nanorod, and (B) a solvent including a compound having a set or specific structure, wherein the solvent has an electrical conductivity of less than 2.0 S/m at 25 C.

Disclosed are an ink composition, a layer manufactured using the ink composition, an electrophoresis apparatus including the layer, and a display device, the ink composition including (A) a semiconductor nanorod, and (B) a solvent including a compound having a set or specific structure, wherein the solvent has an electrical conductivity of less than 2.0 S/m at 25 C.

Disclosed herein are purified surfactant formulations including purified short-chain fluorosurfactant and iodide additive and a two-part coating kit having the same and a silver nanowire formulation.

Disclosed herein are purified surfactant formulations including purified short-chain fluorosurfactant and iodide additive and a two-part coating kit having the same and a silver nanowire formulation.

There is disclosed an ink composition for three dimensional (3D) printing. The ink composition comprises: a liquid dispersion of tungsten carbide (WC) particles and cobalt (Co) particles, and, a carrier vehicle for the dispersion of tungsten carbide particles and the dispersion of cobalt particles. The ink composition is of a viscosity usable with ink jet print heads for 3D printing.

There is disclosed an ink composition for three dimensional (3D) printing. The ink composition comprises: a liquid dispersion of tungsten carbide (WC) particles and cobalt (Co) particles, and, a carrier vehicle for the dispersion of tungsten carbide particles and the dispersion of cobalt particles. The ink composition is of a viscosity usable with ink jet print heads for 3D printing.

A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate and 0.1-10 wt % of a polymeric binder, or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate and 0.25-10 wt % of a polymeric binder, and balance of at least one organic solvent, wherein the binder has ethyl cellulose, and the ethyl cellulose has an average weight molecular weight in a range of 60,000-95,000 g/mol and a bimodal molecular weight distribution.

A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate and 0.1-10 wt % of a polymeric binder, or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate and 0.25-10 wt % of a polymeric binder, and balance of at least one organic solvent, wherein the binder has ethyl cellulose, and the ethyl cellulose has an average weight molecular weight in a range of 60,000-95,000 g/mol and a bimodal molecular weight distribution.

The present invention relates to formulations comprising at least one organic semiconductor and at least one organic solvent, characterized in that the formulation contains less than 10,000 particles per liter formulation having an average size in the range from 0.1 to 20 m, to their use for the preparation of electronic devices, to methods for preparing electronic devices using the formulations of the present invention, and to electronic devices prepared from such methods and formulations.