Patent classifications
C09D11/033
PPTC composition and device having low switch temperature and sharp crystallization behavior
A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.
CONDUCTIVE COMPOSITION FOR MOLDED FILM, MOLDED FILM, MOLDED ARTICLE, AND METHOD FOR PRODUCTION THEREOF
Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180 C. to 270 C. (2) At least one of the following is satisfied: the polar parameter p of the Hansen solubility parameter (HSP) is 0p5.0, and the hydrogen-bond parameter h of the Hansen solubility parameter (HSP) is 9.8h4.0.
CONDUCTIVE COMPOSITION FOR MOLDED FILM, MOLDED FILM, MOLDED ARTICLE, AND METHOD FOR PRODUCTION THEREOF
Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180 C. to 270 C. (2) At least one of the following is satisfied: the polar parameter p of the Hansen solubility parameter (HSP) is 0p5.0, and the hydrogen-bond parameter h of the Hansen solubility parameter (HSP) is 9.8h4.0.
THICKENING STABILIZER AND SOLVENT COMPOSITION USING SAME FOR PRODUCING ELECTRONIC DEVICE
Provided is a compound that thickens a fluid organic material to a desired viscosity and uniformly stabilizes composition thereof. A compound of the present invention is represented by Formula (1): where R.sup.1 represents a monovalent linear aliphatic hydrocarbon group having from 10 to 25 carbons; R.sup.2 and R.sup.3 are the same or different, representing a divalent aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons, a divalent alicyclic hydrocarbon group having 6 carbons, or a divalent aromatic hydrocarbon group; R.sup.4 represents a divalent aliphatic hydrocarbon group having from 1 to 8 carbon(s); R.sup.5 and R.sup.6 are the same or different, representing a monovalent aliphatic hydrocarbon group having from 1 to 3 carbon(s) or a hydroxyalkylether group L.sup.1 to L.sup.3 represent an amide bond; in a case where L.sup.1 and L.sup.3 are CONH, L.sup.2 is NHCO, and in a case where L.sup.1 and L.sup.3 are NHCO, L.sup.2 is CONH.
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THICKENING STABILIZER AND SOLVENT COMPOSITION USING SAME FOR PRODUCING ELECTRONIC DEVICE
Provided is a compound that thickens a fluid organic material to a desired viscosity and uniformly stabilizes composition thereof. A compound of the present invention is represented by Formula (1): where R.sup.1 represents a monovalent linear aliphatic hydrocarbon group having from 10 to 25 carbons; R.sup.2 and R.sup.3 are the same or different, representing a divalent aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons, a divalent alicyclic hydrocarbon group having 6 carbons, or a divalent aromatic hydrocarbon group; R.sup.4 represents a divalent aliphatic hydrocarbon group having from 1 to 8 carbon(s); R.sup.5 and R.sup.6 are the same or different, representing a monovalent aliphatic hydrocarbon group having from 1 to 3 carbon(s) or a hydroxyalkylether group L.sup.1 to L.sup.3 represent an amide bond; in a case where L.sup.1 and L.sup.3 are CONH, L.sup.2 is NHCO, and in a case where L.sup.1 and L.sup.3 are NHCO, L.sup.2 is CONH.
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PRIMER FOR INKJET AND METHOD FOR MANUFACTURING A PRINTED MATERIAL
A primer for inkjet printing includes one or more aqueous resin(s) and hydrophobic particles having a particle size of 0.05 m to 15 m and a melting point of 80 C. to 100 C. The primer improves abrasive resistance properties of an inkjet ink printed on a printed material.
PRIMER FOR INKJET AND METHOD FOR MANUFACTURING A PRINTED MATERIAL
A primer for inkjet printing includes one or more aqueous resin(s) and hydrophobic particles having a particle size of 0.05 m to 15 m and a melting point of 80 C. to 100 C. The primer improves abrasive resistance properties of an inkjet ink printed on a printed material.
AQUEOUS BASED NANOPARTICLE INK
Water-based nanoparticle inks may be formulated to be compatible with printed electronic direct-write methods. The water-based nanoparticle inks may include a functional material (nanoparticle) in combination with an appropriate solvent system. A method may include dispersing nanoparticles in a solvent and printing a circuit in an aerosol jet process or plasma jet process.
AQUEOUS BASED NANOPARTICLE INK
Water-based nanoparticle inks may be formulated to be compatible with printed electronic direct-write methods. The water-based nanoparticle inks may include a functional material (nanoparticle) in combination with an appropriate solvent system. A method may include dispersing nanoparticles in a solvent and printing a circuit in an aerosol jet process or plasma jet process.
Oil-based inkjet ink
An oil-based inkjet ink can be provided which prevents dye conversion of a dye lake pigment contained in the ink, prevents adhesion of the ink to the nozzle plate, and yields excellent drying properties for printed items. The oil-based inkjet ink contains a dye lake pigment, a pigment dispersant and a non-aqueous solvent, wherein the non-aqueous solvent contains a silicone oil having a surface tension of at least 20 mN/m but not more than 28 mN/m. The surface tension of the silicone oil is preferably at least 22 mN/m but not more than 26 mN/m.