The present disclosure relates to a pre-treatment composition for sealing polymeric film, said composition comprising: 0.5 to 10 weight % of a halogenated carboxylic acid, a surfactant, and a liquid solvent.

The present disclosure relates to a pre-treatment composition for sealing polymeric film, said composition comprising: 0.5 to 10 weight % of a halogenated carboxylic acid, a surfactant, and a liquid solvent.

Described herein are metallic pigment-containing inks having a magnitude of exotherm <1200 J/g, or no observable exotherm at all. Also described are metallic pigment-containing inks that include 9.0 wt % or less nitrocellulose resin, or which are essentially free of nitrocellulose resin. Further described are articles printed with the described metallic pigment-containing inks, kits including such inks (and other inks), and methods of printing with such inks. The metallic pigment-containing ink described herein reduce, if not eliminate, the tendency of inks containing metallic pigments to spark and combust.

Described herein are metallic pigment-containing inks having a magnitude of exotherm <1200 J/g, or no observable exotherm at all. Also described are metallic pigment-containing inks that include 9.0 wt % or less nitrocellulose resin, or which are essentially free of nitrocellulose resin. Further described are articles printed with the described metallic pigment-containing inks, kits including such inks (and other inks), and methods of printing with such inks. The metallic pigment-containing ink described herein reduce, if not eliminate, the tendency of inks containing metallic pigments to spark and combust.

In an optical shaping ink set, a composition for model material contains a monofunctional ethylenically unsaturated monomer (A) at 50 to 90 parts by weight, a polyfunctional ethylenically unsaturated monomer (B) which does not contain a urethane group at 3 to 25 parts by weight, a urethane group-containing ethylenically unsaturated monomer (C) at 5 to 35 parts by weight, and a photopolymerization initiator (D) at 0.1 to 10 parts by weight, and the composition for support material contains a water-soluble monofunctional ethylenically unsaturated monomer (a) at 20 to 50 parts by weight, a polyalkylene glycol (b) containing EO and/or PO at 20 to 49 parts by weight, a water-soluble organic solvent (c) at 35 parts by weight or less, and a photopolymerization initiator (d).

In an optical shaping ink set, a composition for model material contains a monofunctional ethylenically unsaturated monomer (A) at 50 to 90 parts by weight, a polyfunctional ethylenically unsaturated monomer (B) which does not contain a urethane group at 3 to 25 parts by weight, a urethane group-containing ethylenically unsaturated monomer (C) at 5 to 35 parts by weight, and a photopolymerization initiator (D) at 0.1 to 10 parts by weight, and the composition for support material contains a water-soluble monofunctional ethylenically unsaturated monomer (a) at 20 to 50 parts by weight, a polyalkylene glycol (b) containing EO and/or PO at 20 to 49 parts by weight, a water-soluble organic solvent (c) at 35 parts by weight or less, and a photopolymerization initiator (d).

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.

Inorganic particulate compositions containing inorganic particles associated with a copolymer of a hydrophilic monomer and a hydrophobic monomer associated with the inorganic particles are provided. The particulate composition satisfies at least one of the following properties: a BET surface area of the inorganic particles is greater than 8 m.sup.2/g, a Hegman value of the inorganic particles is 75 microns or less, and a rate of water loss from the composition upon drying from a moisture level greater than 2% wt % is at least 30% greater than a composition having a corresponding content of a polyacrylate polymer associated with the particles. A method to prepare the composition and formulations for inks, paints, coatings and filled polymeric articles containing the inorganic particulate composition are also provided.

Inorganic particulate compositions containing inorganic particles associated with a copolymer of a hydrophilic monomer and a hydrophobic monomer associated with the inorganic particles are provided. The particulate composition satisfies at least one of the following properties: a BET surface area of the inorganic particles is greater than 8 m.sup.2/g, a Hegman value of the inorganic particles is 75 microns or less, and a rate of water loss from the composition upon drying from a moisture level greater than 2% wt % is at least 30% greater than a composition having a corresponding content of a polyacrylate polymer associated with the particles. A method to prepare the composition and formulations for inks, paints, coatings and filled polymeric articles containing the inorganic particulate composition are also provided.