An ink composition for use as a support ink in three dimensional (3D) printing processes comprises a dispersion of solid particles in liquid carder, compatible with an inkjet print head, wherein after removing the liquid carder, the solid particles serve as support material for a Three Dimensional (3D) printed object, wherein the support material is separable from the 3D printed object.

An ink composition for use as a support ink in three dimensional (3D) printing processes comprises a dispersion of solid particles in liquid carder, compatible with an inkjet print head, wherein after removing the liquid carder, the solid particles serve as support material for a Three Dimensional (3D) printed object, wherein the support material is separable from the 3D printed object.

An object is to achieve both good washing fastness and texture by combining a urethane resin of high fracture elongation with a small quantity of crosslinking agent. As a means for achieving the object, a white inkjet ink composition for textile printing is provided that contains a white pigment, a water-dispersible urethane resin having reactivity to cationic compounds, a crosslinking agent, a water-soluble organic solvent, and water; wherein the crosslinking agent is contained by 0.02 to 0.15 parts by mass relative to 1 part by mass of the water-dispersible urethane resin, and as the water-soluble organic solvent, a glycol ether that dissolves by 1 to 60 g in 100 g of water is contained.

An object is to achieve both good washing fastness and texture by combining a urethane resin of high fracture elongation with a small quantity of crosslinking agent. As a means for achieving the object, a white inkjet ink composition for textile printing is provided that contains a white pigment, a water-dispersible urethane resin having reactivity to cationic compounds, a crosslinking agent, a water-soluble organic solvent, and water; wherein the crosslinking agent is contained by 0.02 to 0.15 parts by mass relative to 1 part by mass of the water-dispersible urethane resin, and as the water-soluble organic solvent, a glycol ether that dissolves by 1 to 60 g in 100 g of water is contained.

This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

An object is to obtain a composition capable of: forming a uniform film even by spray coating or even when the composition is applied in the form of ink for inkjet printing; and preventing light emission from a portion other than an ITO electrode surface when the film is mounted on an organic EL device and light is emitted from the device. A conductive polymer composition contains: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by a general formula (1); H.sub.2O (D) for dispersing the composite; a water-soluble organic solvent (C); and a compound (E) shown by a general formula (2). The electric conductivity of a film with a thickness of 20 to 200 nm formed from the conductive polymer composition is less than 1.00E-05 S/cm.

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An object is to obtain a composition capable of: forming a uniform film even by spray coating or even when the composition is applied in the form of ink for inkjet printing; and preventing light emission from a portion other than an ITO electrode surface when the film is mounted on an organic EL device and light is emitted from the device. A conductive polymer composition contains: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by a general formula (1); H.sub.2O (D) for dispersing the composite; a water-soluble organic solvent (C); and a compound (E) shown by a general formula (2). The electric conductivity of a film with a thickness of 20 to 200 nm formed from the conductive polymer composition is less than 1.00E-05 S/cm.

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