A fluid set can include an ink composition having an acidic pH and a crosslinker composition having a basic pH from pH 8 to pH 10. The ink composition can include from 60 wt % to 90 wt % water, from 5 wt % to 30 wt % organic co-solvent, from 1 wt % to 6 wt % pigment, a sulfonated dispersant, and an acrylic polymer binder. The crosslinker composition can include from 70 wt % to 95 wt % water, from 1 wt % to 25 wt % organic co-solvent, and from 0.5 wt % to 5 wt % polycarbodiimide.

In an embodiment, a system includes a three-dimensional (3D) printer, a feedstock, and a laser. The three-dimensional printer includes a platen including an inert metal, and an enclosure including an inert atmosphere. The feedstock is configured to be deposited onto the platen. The feedstock includes a halogenated solution and a nanoparticle having negative electron affinity. The laser is configured to induce the nanoparticle to emit solvated electrons into the halogenated solution to form, by reduction, a ceramic and a diatomic halogen.

In an embodiment, a system includes a three-dimensional (3D) printer, a feedstock, and a laser. The three-dimensional printer includes a platen including an inert metal, and an enclosure including an inert atmosphere. The feedstock is configured to be deposited onto the platen. The feedstock includes a halogenated solution and a nanoparticle having negative electron affinity. The laser is configured to induce the nanoparticle to emit solvated electrons into the halogenated solution to form, by reduction, a ceramic and a diatomic halogen.

In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises a thiol monomer component and an ene monomer component. Moreover, in some cases, an ink described herein further comprises an additional (meth)acrylate monomer component differing from the ene monomer component. In some such cases, the additional (meth)acrylate monomer component can be polymerized separately from the thiol and ene monomers of the ink.

In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises a thiol monomer component and an ene monomer component. Moreover, in some cases, an ink described herein further comprises an additional (meth)acrylate monomer component differing from the ene monomer component. In some such cases, the additional (meth)acrylate monomer component can be polymerized separately from the thiol and ene monomers of the ink.

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.

The present disclosure discloses a liquid electrophotographic ink. The ink includes a liquid vehicle, an ethylene acid copolymer, and an ethylene/(meth)acrylic acid C1-10 alkyl ester copolymer. Also disclosed is a method for the manufacture that ink and a method for performing a liquid electrophotographic process by printing a substrate with the ink.

The present disclosure discloses a liquid electrophotographic ink. The ink includes a liquid vehicle, an ethylene acid copolymer, and an ethylene/(meth)acrylic acid C1-10 alkyl ester copolymer. Also disclosed is a method for the manufacture that ink and a method for performing a liquid electrophotographic process by printing a substrate with the ink.

In an example of a method for three-dimensional (3D) printing, build material layers are patterned to form an intermediate structure. During patterning, a binding agent is selectively applied to define a patterned intermediate part. Also during patterning, i) the binding agent and a separate agent including a gas precursor are, or ii) a combined agent including a binder and the gas precursor is, selectively applied to define a build material support structure adjacent to at least a portion of the patterned intermediate part. The intermediate structure is heated to a temperature that activates the gas precursor to create gas pockets in the build material support structure.