An object of the present invention is to provide an ink composition for manufacturing an organic semiconductor device, the ink composition allowing an organic semiconductor material with a rigid main chain into an ink having an optimal solute concentration for a single-crystal formation process. The present invention provides an ink composition for manufacturing an organic semiconductor device, the ink composition including at least one solvent selected from Naphthalene Compound (A) and at least one solute. The isomer content of Naphthalene Compound (A) is preferably 2% or less in terms of a percentage for peak area with Naphthalene Compound (A) being 100% in gas chromatography. Naphthalene Compound (A): a compound represented by Formula (a), where in Formula (a), R is as defined in the description.

An object of the present invention is to provide an ink composition for manufacturing an organic semiconductor device, the ink composition allowing an organic semiconductor material with a rigid main chain into an ink having an optimal solute concentration for a single-crystal formation process. The present invention provides an ink composition for manufacturing an organic semiconductor device, the ink composition including at least one solvent selected from Naphthalene Compound (A) and at least one solute. The isomer content of Naphthalene Compound (A) is preferably 2% or less in terms of a percentage for peak area with Naphthalene Compound (A) being 100% in gas chromatography. Naphthalene Compound (A): a compound represented by Formula (a), where in Formula (a), R is as defined in the description.

A method to manufacture an article comprises applying an ink to a substrate. The ink includes a liquid vehicle, a plurality of solid metal particles, a plurality of gallium-containing particles, and a thermally activated flux. The method further comprises curing the ink by heating the substrate to within an activation temperature range of the flux. The article manufactured by this method comprises a substrate, an electronically conductive film arranged on the substrate, and an adherent barrier layer covering both the substrate and the film. The film includes a plurality of solid metal particles with a gallium-based liquid metal bridging the plurality of solid metal particles.

This specification discloses non-aqueous solvent, pigmented ink formulations that are suitable for the electronic and aerospace industries and form printed marks that are resistant to smearing and dissolution by organic solvents commonly used in overcoatings in this industry and others. These ink formulations are based on use of an acidic resin with an inherent acid value of at least about 25 mg KOH/g, preferably at least partially neutralized by a quaternary ammonium hydroxide and/or alcohol amine acid neutralizing or modifying agent.

This specification discloses non-aqueous solvent, pigmented ink formulations that are suitable for the electronic and aerospace industries and form printed marks that are resistant to smearing and dissolution by organic solvents commonly used in overcoatings in this industry and others. These ink formulations are based on use of an acidic resin with an inherent acid value of at least about 25 mg KOH/g, preferably at least partially neutralized by a quaternary ammonium hydroxide and/or alcohol amine acid neutralizing or modifying agent.

Disclosed is a patterning method by ink lithography. More particularly, the patterning method includes coating thin film-forming nanoparticles surrounded by the first ligand on a substrate to form a nanoparticle thin film; directly spraying a ligand-substituting ink to a selected region on the nanoparticle thin film to form a region in which the first ligand is substituted with the second ligand; and washing the nanoparticle thin film with a washing solvent so that the region substituted with the second ligand is patterned.

Disclosed is a patterning method by ink lithography. More particularly, the patterning method includes coating thin film-forming nanoparticles surrounded by the first ligand on a substrate to form a nanoparticle thin film; directly spraying a ligand-substituting ink to a selected region on the nanoparticle thin film to form a region in which the first ligand is substituted with the second ligand; and washing the nanoparticle thin film with a washing solvent so that the region substituted with the second ligand is patterned.

A three-dimensional printing kit can include a fusing agent including water and a radiation absorber and a build material that can include from 95 wt % to 100 wt % of annealed polyether polyamide copolymer particles that can have a D50 particle size from about 2 μm to about 150 μm.

A three-dimensional printing kit can include a fusing agent including water and a radiation absorber and a build material that can include from 95 wt % to 100 wt % of annealed polyether polyamide copolymer particles that can have a D50 particle size from about 2 μm to about 150 μm.

An object of the present invention is to provide an inkjet aqueous composition that can sufficiently and easily prevent deterioration or corrosion of a silicon member that forms an ink channel. The present invention relates to an inkjet aqueous composition containing an aqueous medium and a surfactant, in which the surfactant includes a polysiloxane compound having a siloxane structure (—Si—O—) with a repetition number of 5 or more and 1000 or less, and to an inkjet aqueous ink, an inkjet aqueous primer, an inkjet aqueous cleaning liquid, an inkjet aqueous preservation liquid, and an inkjet recording device.