C09D11/033

Methods and compositions for direct print having improved recyclability

The disclosure relates to ink compositions for digital printing on an external surface of a plastic article. The ink compositions comprise an ink removal-promoting additive. In some aspects, the ink removal-promoting additive can facilitate the separation or loosening of the image from the external surface of the article when the image is exposed to a liquid-based solution at an elevated temperature. Also disclosed are recyclable plastic articles having an external surface with an image printed thereon using the disclosed ink composition and methods for removing cured ink from a plastic container. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Methods and compositions for direct print having improved recyclability

The disclosure relates to ink compositions for digital printing on an external surface of a plastic article. The ink compositions comprise an ink removal-promoting additive. In some aspects, the ink removal-promoting additive can facilitate the separation or loosening of the image from the external surface of the article when the image is exposed to a liquid-based solution at an elevated temperature. Also disclosed are recyclable plastic articles having an external surface with an image printed thereon using the disclosed ink composition and methods for removing cured ink from a plastic container. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Copper based conductive ink composition and method of making the same

Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.

Copper based conductive ink composition and method of making the same

Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.

AQUEOUS INK
20220033668 · 2022-02-03 · ·

The present invention relates to a water-based ink containing at least pigment-containing water-insoluble crosslinked polymer particles (A), a polymer emulsion (B) and water, in which a water-insoluble crosslinked polymer constituting the crosslinked polymer particles (A) is obtained by subjecting a polymer that contains a constitutional unit derived from a carboxylic acid monomer having an acid value of not less than 200 mgKOH/g and a constitutional unit derived from a hydrophobic monomer, to crosslinking reaction with an epoxy compound, and a polymer constituting the polymer emulsion (B) contains a constitutional unit derived from a carboxylic acid monomer and a constitutional unit derived from a hydrophobic monomer. The water-based ink of the present invention is excellent in ejection stability and fastness of the printed characters or images while maintaining good optical density.

AQUEOUS INK
20220033668 · 2022-02-03 · ·

The present invention relates to a water-based ink containing at least pigment-containing water-insoluble crosslinked polymer particles (A), a polymer emulsion (B) and water, in which a water-insoluble crosslinked polymer constituting the crosslinked polymer particles (A) is obtained by subjecting a polymer that contains a constitutional unit derived from a carboxylic acid monomer having an acid value of not less than 200 mgKOH/g and a constitutional unit derived from a hydrophobic monomer, to crosslinking reaction with an epoxy compound, and a polymer constituting the polymer emulsion (B) contains a constitutional unit derived from a carboxylic acid monomer and a constitutional unit derived from a hydrophobic monomer. The water-based ink of the present invention is excellent in ejection stability and fastness of the printed characters or images while maintaining good optical density.

INK COMPOSITION AND PHOTOELECTRIC CONVERSION DEVICE PRODUCED USING THE SAME

An ink composition containing a P-type semiconductor material, an N-type semiconductor material and two or more solvents including a first solvent and a second solvent, wherein the total amount of the first solvent and the second solvent is 70% by weight or more with respect to 100% by weight of all the solvents contained in the ink composition; the boiling point of the first solvent is lower than the boiling point of the second solvent; the boiling point of the first solvent is 120° C. or more and 400° C. or less; and the hydrogen bond Hansen solubility parameter H1 (MPa.sup.0.5) of the first solvent and the hydrogen bond Hansen solubility parameter H2 (MPa.sup.0.5) of the second solvent are in the relation of 0.5≦(H2−H1)≦5.0.

INK COMPOSITION AND PHOTOELECTRIC CONVERSION DEVICE PRODUCED USING THE SAME

An ink composition containing a P-type semiconductor material, an N-type semiconductor material and two or more solvents including a first solvent and a second solvent, wherein the total amount of the first solvent and the second solvent is 70% by weight or more with respect to 100% by weight of all the solvents contained in the ink composition; the boiling point of the first solvent is lower than the boiling point of the second solvent; the boiling point of the first solvent is 120° C. or more and 400° C. or less; and the hydrogen bond Hansen solubility parameter H1 (MPa.sup.0.5) of the first solvent and the hydrogen bond Hansen solubility parameter H2 (MPa.sup.0.5) of the second solvent are in the relation of 0.5≦(H2−H1)≦5.0.

High-Quality/High-Definition Screen Printing Ink Composition for Glass Substrate, Printed Product Obtained by Screen Printing Said Ink Composition, and Manufacturing Method for Said Printed Product
20170233593 · 2017-08-17 ·

An ink composition for screen printing for a glass substrate includes a solvent with a boiling point at least 170° C. at least 70 mass % of the total solvent and a prepolymer or polymer with a weight-average molecular weight of at least 2000 at least at 2 mass % with respect to total ink composition, and with a viscosity of 5 to 180 Pa.Math.s measured with a BH-type rotating viscosimeter at 25° C. and thixotropic index (TI value) of 2.0 to 8.0, the measured flow radius value being 13.0 to 24.0 mm after 1 minute from start of measurement by a flow property measuring method using a spread meter at 25° C. according to JIS K5701-1:2000, satisfying “F60”−“F45”≦1.0 mm, where “F60” and “F45” are measured flow radius values after 1 minute and 45 seconds, respectively, from start of measurement, and containing a coupling agent compound.

High-Quality/High-Definition Screen Printing Ink Composition for Glass Substrate, Printed Product Obtained by Screen Printing Said Ink Composition, and Manufacturing Method for Said Printed Product
20170233593 · 2017-08-17 ·

An ink composition for screen printing for a glass substrate includes a solvent with a boiling point at least 170° C. at least 70 mass % of the total solvent and a prepolymer or polymer with a weight-average molecular weight of at least 2000 at least at 2 mass % with respect to total ink composition, and with a viscosity of 5 to 180 Pa.Math.s measured with a BH-type rotating viscosimeter at 25° C. and thixotropic index (TI value) of 2.0 to 8.0, the measured flow radius value being 13.0 to 24.0 mm after 1 minute from start of measurement by a flow property measuring method using a spread meter at 25° C. according to JIS K5701-1:2000, satisfying “F60”−“F45”≦1.0 mm, where “F60” and “F45” are measured flow radius values after 1 minute and 45 seconds, respectively, from start of measurement, and containing a coupling agent compound.