Provided herein are conductive inks and methods of formulation thereof, whose electric and mechanical properties (e.g. viscosity and surface tension) enable its use in a wide array of printing techniques. The outstanding conductivity, thermal stability, chemical stability, and flexibility of graphene in the inks herein enable the production of low-cost electronics with tunable electrochemical properties

Provided herein are conductive inks and methods of formulation thereof, whose electric and mechanical properties (e.g. viscosity and surface tension) enable its use in a wide array of printing techniques. The outstanding conductivity, thermal stability, chemical stability, and flexibility of graphene in the inks herein enable the production of low-cost electronics with tunable electrochemical properties

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

A reactive ink composition comprising a UV-C radiation sensitive polymer, an acid scavenger, a photoinitiator, and a pH-sensitive dye. A method to print a composition onto a UV-C radiation dosimeter using a “layer-by-layer” deposition technique, as well as a dosimeter comprising the reactive ink composition, useful in monitoring the efficiency of a UV-C radiation sterilization or disinfection process.

A reactive ink composition comprising a UV-C radiation sensitive polymer, an acid scavenger, a photoinitiator, and a pH-sensitive dye. A method to print a composition onto a UV-C radiation dosimeter using a “layer-by-layer” deposition technique, as well as a dosimeter comprising the reactive ink composition, useful in monitoring the efficiency of a UV-C radiation sterilization or disinfection process.

This invention provides resin formulations which may be used for 3D printing and pyrolyzing to produce a ceramic matrix composite. The resin formulations contain a solid-phase filler, to provide high thermal stability and mechanical strength (e.g., fracture toughness) in the final ceramic material. The invention provides direct, free-form 3D printing of a preceramic polymer loaded with a solid-phase filler, followed by converting the preceramic polymer to a 3D-printed ceramic matrix composite with potentially complex 3D shapes or in the form of large parts. Other variations provide active solid-phase functional additives as solid-phase fillers, to perform or enhance at least one chemical, physical, mechanical, or electrical function within the ceramic structure as it is being formed as well as in the final structure. Solid-phase functional additives actively improve the final ceramic structure through one or more changes actively induced by the additives during pyrolysis or other thermal treatment.

This invention provides resin formulations which may be used for 3D printing and pyrolyzing to produce a ceramic matrix composite. The resin formulations contain a solid-phase filler, to provide high thermal stability and mechanical strength (e.g., fracture toughness) in the final ceramic material. The invention provides direct, free-form 3D printing of a preceramic polymer loaded with a solid-phase filler, followed by converting the preceramic polymer to a 3D-printed ceramic matrix composite with potentially complex 3D shapes or in the form of large parts. Other variations provide active solid-phase functional additives as solid-phase fillers, to perform or enhance at least one chemical, physical, mechanical, or electrical function within the ceramic structure as it is being formed as well as in the final structure. Solid-phase functional additives actively improve the final ceramic structure through one or more changes actively induced by the additives during pyrolysis or other thermal treatment.

A functional ink suitable for 3D printing and a preparation method thereof are provided. The ink includes the following components in parts by weight: 0.5-1.5 parts of a regulator, 1-5 parts of a conductive material, 0.1-0.5 parts of a crosslinking agent, 0.1-0.5 parts of a catalyst, and 10-80 parts of a solvent. The prepared functional ink has a self-healing function at room temperature, eliminating the interface resistance between printing layers and improving the mechanical strength between the layers. Moreover, the prepared functional ink has excellent electrical conductivity and a variety of electrical, magnetic, and electrochemical properties, and can be applied in the fields of functional materials and devices such as energy storage, electromagnetic shielding and stress sensing.

A functional ink suitable for 3D printing and a preparation method thereof are provided. The ink includes the following components in parts by weight: 0.5-1.5 parts of a regulator, 1-5 parts of a conductive material, 0.1-0.5 parts of a crosslinking agent, 0.1-0.5 parts of a catalyst, and 10-80 parts of a solvent. The prepared functional ink has a self-healing function at room temperature, eliminating the interface resistance between printing layers and improving the mechanical strength between the layers. Moreover, the prepared functional ink has excellent electrical conductivity and a variety of electrical, magnetic, and electrochemical properties, and can be applied in the fields of functional materials and devices such as energy storage, electromagnetic shielding and stress sensing.