The present disclosure provides a method of manufacturing a conductive coating which includes preparing a conductive powder, preparing a wet conductive powder, preparing a base slurry, and performing a centrifugal mixing process. A graphite and a carbon black are uniformly mixed and performed on a powder refining process to obtain the conductive powder. The conductive powder and an additive are uniformly mixed to obtain the wet conductive powder. A neoprene and a solvent are uniformly mixed and performed on a ball milling process to obtain the base slurry. 45 parts by weight to 55 parts by weight of the wet conductive powder and 45 parts by weight to 55 parts by weight of the base slurry are centrifugal mixed in a centrifugal mixing process at 900 rpm to 1000 rpm to obtain the conductive coating having a viscosity between 55000 cP and 60000 cP.

The present disclosure provides a method of manufacturing a conductive coating which includes preparing a conductive powder, preparing a wet conductive powder, preparing a base slurry, and performing a centrifugal mixing process. A graphite and a carbon black are uniformly mixed and performed on a powder refining process to obtain the conductive powder. The conductive powder and an additive are uniformly mixed to obtain the wet conductive powder. A neoprene and a solvent are uniformly mixed and performed on a ball milling process to obtain the base slurry. 45 parts by weight to 55 parts by weight of the wet conductive powder and 45 parts by weight to 55 parts by weight of the base slurry are centrifugal mixed in a centrifugal mixing process at 900 rpm to 1000 rpm to obtain the conductive coating having a viscosity between 55000 cP and 60000 cP.

A coating layer application device (200) for applying a coating layer, which is located on a transfer element, to a substrate, the coating layer (206) being formed from a coating material, in particular a thermosetting coating material, the coating layer (206) being curable and comprising an amorphous material, the coating layer application device comprising: a heating device (214, 220) being configured so as to (i) maintain the temperature of the coating layer (206) within a temperature range before removal of N the transfer element (204) from the coating layer (206), wherein within the temperature range the uncured coating material is in its supercooled liquid state; and/or (ii) partially cure the coating layer (206) during a contact of the coating layer (206) and the substrate (210) and before removal of the transfer element (204) from the coating layer, in particular by increasing the temperature of the coating layer (206) to a temperature at or above a curing temperature of the coating layer (206).

A coating layer application device (200) for applying a coating layer, which is located on a transfer element, to a substrate, the coating layer (206) being formed from a coating material, in particular a thermosetting coating material, the coating layer (206) being curable and comprising an amorphous material, the coating layer application device comprising: a heating device (214, 220) being configured so as to (i) maintain the temperature of the coating layer (206) within a temperature range before removal of N the transfer element (204) from the coating layer (206), wherein within the temperature range the uncured coating material is in its supercooled liquid state; and/or (ii) partially cure the coating layer (206) during a contact of the coating layer (206) and the substrate (210) and before removal of the transfer element (204) from the coating layer, in particular by increasing the temperature of the coating layer (206) to a temperature at or above a curing temperature of the coating layer (206).

A printing process for printing with ink an image on an antimicrobial medical glove formed by a dipping process, wherein the image is first printed on a former and transferred to the glove during dipping.

A printing process for printing with ink an image on an antimicrobial medical glove formed by a dipping process, wherein the image is first printed on a former and transferred to the glove during dipping.

An isoindoline derivative of formula

##STR00001##

wherein
X is N, C—CN or C—COR.sup.2;
Y is a radical having an acidic group or a basic group;
R.sup.1 is independently from one another halogen or C.sub.1-C.sub.4-alkyl, said alkyl is unsubstituted or substituted with halogen;
R.sup.2 is C.sub.1-C.sub.4-alkyl, said alkyl is unsubstituted or substituted with halogen; and
n is 0, 1, 2, 3 or 4,
with the proviso that Y does not include an acidic group if X is C—CN or C—COR.sup.2, and compositions containing the same are provided. The isoindoline derivative and the pigment composition are suitable, for example, for coloring high molecular mass organic material, especially paints, printing inks, resist formulations for color filter applications, electrophotographic toners, cosmetics, plastics, films or fibers.

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

A composition for forming a contiguous conductive feature on a substrate includes silver nanoparticles, a titanium precursor compound, a first non-aqueous polar protic solvent, and a second non-aqueous polar protic solvent. The concentration of the titanium precursor compound in the composition is in a range of 2 vol % to 13 vol %. A method of forming a contiguous conductive feature on a substrate includes dispensing the composition on the substrate to form a contiguous precursor feature and sintering the contiguous precursor feature at a sintering temperature in a range of 300° C. to 500° C. to form the contiguous conductive feature. Example titanium precursor compounds are: titanium(IV) butoxide, titanium(IV) isopropoxide, titanium(IV) chloride, tetrakis(diethylamido)titanium(IV), and dimethyltitanocene.