A device including an electrically conducting track arranged on a support includes a step of supply of the support, and a step of formation of the electrically conducting track on the support including a step of supply of a solution intended to be deposited on the support, a step of deposition of the solution by printing on the support. The step of supply of the solution is such that the solution supplied includes a mixture of a solvent, of a set of metal particles and of a metallic material having a melting point below that of the metal particles of the set of metal particles, and the method includes a step of melting of the metallic material which results in the formation of a solder of metallic material between metal particles of the set of metal particles.

A metal oxide composition, including: a solvent; and a metal oxide, wherein the solvent includes a first compound represented by Formula 1, and the metal oxide includes a second compound represented by Formula 2

##STR00001##

##STR00002##

wherein, X.sub.1 and X.sub.2 are each independently *—B(R.sub.1a)—*’, *—N(R.sub.1a)—*’, *—O—*’, *—P(R.sub.1a)—*’, *—P(═O)(R.sub.1a)—*’, *—S—*, *—S(═O)—*’, *—S(═O).sub.2—*’, or *—Si(R.sub.1a)(R.sub.1b)—*’; * and *’ each indicate a binding site to a neighboring atom; R.sub.1 is hydrogen or deuterium; M is Zn, Ti, Zr, Sn, W, Ta, Ni, Mo, Cu, or V; p and q are each independently from 1 to 5; and the other substituents are respectively as described in the present specification.

A metal oxide composition, including: a solvent; and a metal oxide, wherein the solvent includes a first compound represented by Formula 1, and the metal oxide includes a second compound represented by Formula 2

##STR00001##

##STR00002##

wherein, X.sub.1 and X.sub.2 are each independently *—B(R.sub.1a)—*’, *—N(R.sub.1a)—*’, *—O—*’, *—P(R.sub.1a)—*’, *—P(═O)(R.sub.1a)—*’, *—S—*, *—S(═O)—*’, *—S(═O).sub.2—*’, or *—Si(R.sub.1a)(R.sub.1b)—*’; * and *’ each indicate a binding site to a neighboring atom; R.sub.1 is hydrogen or deuterium; M is Zn, Ti, Zr, Sn, W, Ta, Ni, Mo, Cu, or V; p and q are each independently from 1 to 5; and the other substituents are respectively as described in the present specification.

A metallic nanoparticle dispersion includes metallic nanoparticles and a compound according to Formula I, ##STR00001##
wherein X represents the necessary atoms to form a substituted or unsubstituted ring. The presence of small amounts of the compound according to Formula I increases the conductivity of metallic layers or patterns formed from the metallic nanoparticle dispersions at moderate curing conditions.

A metallic nanoparticle dispersion includes metallic nanoparticles and a compound according to Formula I, ##STR00001##
wherein X represents the necessary atoms to form a substituted or unsubstituted ring. The presence of small amounts of the compound according to Formula I increases the conductivity of metallic layers or patterns formed from the metallic nanoparticle dispersions at moderate curing conditions.

Graphene ink compositions as can be utilized with gravure and screen printing processes, to provide flexible electronic components with high-resolution printed graphene circuitry.

Graphene ink compositions as can be utilized with gravure and screen printing processes, to provide flexible electronic components with high-resolution printed graphene circuitry.

Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30° C. to 90° C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10Ω/□, or even less than 1Ω/□.

Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30° C. to 90° C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10Ω/□, or even less than 1Ω/□.

The present invention provides an inkjet ink that contains a metal complex dye, a polyoxyethylene based compound with which a number average molecular weight Mn is not less than 200, a tackifier with which a hydroxyl value is 30 to 70 mgKOH/g, a first solvent of at least one type selected from a group consisting of ketones, ethers, and esters and with which an SP value is less than 11, and a second solvent being an alcohol including at least an alcohol with 1 to 3 carbon atoms and with which the SP value is not less than 11 and is solvent based and does not contain (excludes) water, is unlikely to cause cogation, is also excellent in intermittent printing performance, and yet enables a character of excellent fixing property and abrasion resistance to be printed on a surface of a printing object with a non-absorbing property.