A composition for forming a patterned thin metal film on a substrate is presented. The composition includes metal cations; and at least one solvent, wherein the patterned thin metal film is adhered to a surface of the substrate upon exposure of the at least metal cations to a low-energy plasma.

A composition for forming a patterned thin metal film on a substrate is presented. The composition includes metal cations; and at least one solvent, wherein the patterned thin metal film is adhered to a surface of the substrate upon exposure of the at least metal cations to a low-energy plasma.

A ligand-modified quantum dot composition, a ligand-modified quantum dot layer, preparation methods thereof, and a quantum dot light emitting diode are provided. Segment B of the ligand modifier in the ligand-modified quantum dot composition is a chain-cleavable segment, that is, segment B is a longer molecular chain, so that the material has good solubility and stability, thus the ligand-modified quantum dot composition is present in the form of a solution or ink, etc. Segment B itself is not very stable and may be cleaved under certain conditions. In specific applications, the group in segment B may be cleaved by heating or illumination, so that the ligand modifier becomes a short molecular chain ligand, thereby making the quantum dots densely stack and improving the carrier transfer performance.

A ligand-modified quantum dot composition, a ligand-modified quantum dot layer, preparation methods thereof, and a quantum dot light emitting diode are provided. Segment B of the ligand modifier in the ligand-modified quantum dot composition is a chain-cleavable segment, that is, segment B is a longer molecular chain, so that the material has good solubility and stability, thus the ligand-modified quantum dot composition is present in the form of a solution or ink, etc. Segment B itself is not very stable and may be cleaved under certain conditions. In specific applications, the group in segment B may be cleaved by heating or illumination, so that the ligand modifier becomes a short molecular chain ligand, thereby making the quantum dots densely stack and improving the carrier transfer performance.

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.

A multi-fluid kit for three-dimensional printing can include a wetting agent and a binding agent. The wetting agent can include from 0 wt % to about 49.8 wt % water, from about 0.5 wt % to about 30 wt % film-forming organic solvent that can have a boiling point from greater than about 100° C. to about 350° C., and from about 30 wt % to about 99.5 wt % amphiphilic solvent that can have a boiling point from about 45° C. to less than about 100° C. The amphiphilic solvent can be water-miscible and can be present in the wetting agent at a greater concentration than the water and at a greater concentration than the film-forming solvent. The binding agent can include from about 2 wt % to about 30 wt % of a polymer binder dispersed in an aqueous liquid vehicle.

A multi-fluid kit for three-dimensional printing can include a wetting agent and a binding agent. The wetting agent can include from 0 wt % to about 49.8 wt % water, from about 0.5 wt % to about 30 wt % film-forming organic solvent that can have a boiling point from greater than about 100° C. to about 350° C., and from about 30 wt % to about 99.5 wt % amphiphilic solvent that can have a boiling point from about 45° C. to less than about 100° C. The amphiphilic solvent can be water-miscible and can be present in the wetting agent at a greater concentration than the water and at a greater concentration than the film-forming solvent. The binding agent can include from about 2 wt % to about 30 wt % of a polymer binder dispersed in an aqueous liquid vehicle.

A three-dimensional printing kit can include a powder bed material and a fusing agent to selectively apply to the powder bed material. The powder bed material can include polymer particles and a thermochromic additive. The thermochromic additive can be chemically stable at a melting point temperature of the polymer particles, and the thermochromic additive can exhibit a color change at a color transition temperature that is below the melting point of the polymer particles. The fusing agent can include water and a radiation absorber to absorb radiation energy and convert the radiation energy to heat.

A three-dimensional printing kit can include a powder bed material and a fusing agent to selectively apply to the powder bed material. The powder bed material can include polymer particles and a thermochromic additive. The thermochromic additive can be chemically stable at a melting point temperature of the polymer particles, and the thermochromic additive can exhibit a color change at a color transition temperature that is below the melting point of the polymer particles. The fusing agent can include water and a radiation absorber to absorb radiation energy and convert the radiation energy to heat.