Patent classifications
C09D11/101
Formulations with active functional additives for 3D printing of preceramic polymers, and methods of 3D-printing the formulations
This invention provides resin formulations which may be used for 3D printing and pyrolyzing to produce a ceramic matrix composite. The resin formulations contain a solid-phase filler, to provide high thermal stability and mechanical strength (e.g., fracture toughness) in the final ceramic material. The invention provides direct, free-form 3D printing of a preceramic polymer loaded with a solid-phase filler, followed by converting the preceramic polymer to a 3D-printed ceramic matrix composite with potentially complex 3D shapes or in the form of large parts. Other variations provide active solid-phase functional additives as solid-phase fillers, to perform or enhance at least one chemical, physical, mechanical, or electrical function within the ceramic structure as it is being formed as well as in the final structure. Solid-phase functional additives actively improve the final ceramic structure through one or more changes actively induced by the additives during pyrolysis or other thermal treatment.
Formulations with active functional additives for 3D printing of preceramic polymers, and methods of 3D-printing the formulations
This invention provides resin formulations which may be used for 3D printing and pyrolyzing to produce a ceramic matrix composite. The resin formulations contain a solid-phase filler, to provide high thermal stability and mechanical strength (e.g., fracture toughness) in the final ceramic material. The invention provides direct, free-form 3D printing of a preceramic polymer loaded with a solid-phase filler, followed by converting the preceramic polymer to a 3D-printed ceramic matrix composite with potentially complex 3D shapes or in the form of large parts. Other variations provide active solid-phase functional additives as solid-phase fillers, to perform or enhance at least one chemical, physical, mechanical, or electrical function within the ceramic structure as it is being formed as well as in the final structure. Solid-phase functional additives actively improve the final ceramic structure through one or more changes actively induced by the additives during pyrolysis or other thermal treatment.
Curable liquid composition, composition-accommodating container, liquid composition discharging device, cured material, and method of manufacturing cured material
A curable liquid composition includes a monomer having an SI value of less than 3.0 and a photopolymerization initiator having a weight average molecular weight of 500 or greater, wherein the curable liquid composition is negative in skin sensitization.
Curable liquid composition, composition-accommodating container, liquid composition discharging device, cured material, and method of manufacturing cured material
A curable liquid composition includes a monomer having an SI value of less than 3.0 and a photopolymerization initiator having a weight average molecular weight of 500 or greater, wherein the curable liquid composition is negative in skin sensitization.
Systems and methods of additive printing of functional electronic circuits
A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.
Systems and methods of additive printing of functional electronic circuits
A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.
Active energy ray curable-type ink jet ink, light shielding film, and method of manufacturing light shielding film
An active energy ray curable-type ink jet ink containing: titanium black; and a monomer A which is a non-aromatic heterocyclic compound having an ethylenically unsaturated double bond, a light shielding film, and a method of manufacturing the light shielding film.
Compound, composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
A compound including two or more partial structures shown by the following general formula (1-1) in the molecule, ##STR00001## wherein each Ar independently represents an aromatic ring optionally having a substituent or an aromatic ring that contains at least one nitrogen atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with an organic group; B represents an anionic leaving group that is capable of forming a reactive cation due to effect of either or both of heat and acid. This provides a compound that is capable of curing under the film forming conditions in air or an inert gas without forming byproducts, and forming an organic under layer film that has good dry etching durability during substrate processing not only excellent characteristics of gap filling and planarizing a pattern formed on a substrate.
Method for making a security document comprising a thermoplastic substrate and UV-cured image and security document formed thereby
A method is provided by the invention for making a security document comprising a thermoplastic substrate with a UV light cured printed image that is less likely to result in splitting of the ink of the UV light cured printed image during the lamination step of forming the thermoplastic substrate. The UV light cured image is applied to an interior thermoplastic layer surface of a stack of thermoplastic layers configured to form a thermoplastic substrate upon lamination of the stack and comprises numerous small sub-portions having small gaps between them sufficient to permit relative movement of individual sub-portions during lamination, the thermoplastic layer(s) from the ultraviolet light cured image to an exterior surface of the stack being sufficiently see-through that the image is visible upon viewing the security document. Alternatively, or additionally, the image is applied to an interior surface of an outermost thermoplastic layer of the stack adjacent an intermediate thermoplastic layer of the stack wherein the outermost thermoplastic layer has a higher melting point than the melting point of at least the adjacent intermediate thermoplastic layer.
Method for making a security document comprising a thermoplastic substrate and UV-cured image and security document formed thereby
A method is provided by the invention for making a security document comprising a thermoplastic substrate with a UV light cured printed image that is less likely to result in splitting of the ink of the UV light cured printed image during the lamination step of forming the thermoplastic substrate. The UV light cured image is applied to an interior thermoplastic layer surface of a stack of thermoplastic layers configured to form a thermoplastic substrate upon lamination of the stack and comprises numerous small sub-portions having small gaps between them sufficient to permit relative movement of individual sub-portions during lamination, the thermoplastic layer(s) from the ultraviolet light cured image to an exterior surface of the stack being sufficiently see-through that the image is visible upon viewing the security document. Alternatively, or additionally, the image is applied to an interior surface of an outermost thermoplastic layer of the stack adjacent an intermediate thermoplastic layer of the stack wherein the outermost thermoplastic layer has a higher melting point than the melting point of at least the adjacent intermediate thermoplastic layer.