Provided is a photocurable resin composition containing an allylic polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition containing an allylic polymer (A), the allylic polymer (A) being produced by polymerization of an allylic compound represented by the following formula (I): ##STR00001##

Provided is a photocurable resin composition containing an allylic polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition containing an allylic polymer (A), the allylic polymer (A) being produced by polymerization of an allylic compound represented by the following formula (I): ##STR00001##

In order to satisfy the demand of consumers regarding design attractiveness, an infrared-light-transmitting dark color ink is provided, the ink having a black appearance and attaining high design attractiveness and, despite this, having sufficient infrared-light-transmitting property. The infrared-light-transmitting dark color ink transmits near infrared light having wavelengths of 750-1,500 nm, and comprises a resin component and a pigment component that comprises both a brown pigment, e.g., a benzimidazolone pigment, and a phthalocyanine pigment.

In order to satisfy the demand of consumers regarding design attractiveness, an infrared-light-transmitting dark color ink is provided, the ink having a black appearance and attaining high design attractiveness and, despite this, having sufficient infrared-light-transmitting property. The infrared-light-transmitting dark color ink transmits near infrared light having wavelengths of 750-1,500 nm, and comprises a resin component and a pigment component that comprises both a brown pigment, e.g., a benzimidazolone pigment, and a phthalocyanine pigment.

An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises a thiol monomer component and an ene monomer component. Moreover, in some cases, an ink described herein further comprises an additional (meth)acrylate monomer component differing from the ene monomer component. In some such cases, the additional (meth)acrylate monomer component can be polymerized separately from the thiol and ene monomers of the ink.

In one aspect, inks for use with a three-dimensional printing system are described herein. In some embodiments, an ink described herein comprises a thiol monomer component and an ene monomer component. Moreover, in some cases, an ink described herein further comprises an additional (meth)acrylate monomer component differing from the ene monomer component. In some such cases, the additional (meth)acrylate monomer component can be polymerized separately from the thiol and ene monomers of the ink.