The present invention relates to the field of security documents and their protection against counterfeit and illegal reproduction and relates to the field of intaglio printing processes for the printing of said security documents. In particular, the present invention relates to radiation curable intaglio inks suitable for intaglio printing a pattern or image, wherein said intaglio printing comprises wiping off ink excess with a polymeric wiping cylinder and cleaning said cylinder with an alkaline aqueous wiping solution, The disclosed radiation curable intaglio inks comprise one or more radiation curable compounds, wherein at least one of said one or more radiation curable compounds is a fatty acid polyester (meth)acrylate oligomer; one or more photoinitiators; and a high molecular weight acid modified alkyd surfactant and/or an alkylarene sulfonic acid surfactant; one or more fillers or extenders.

The invention provides an inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board. By using a solder mask inkjet ink containing at least one photoinitiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter, a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties, may be produced.

The invention provides an inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board. By using a solder mask inkjet ink containing at least one photoinitiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter, a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties, may be produced.

A method of producing a printed product, wherein a formulation for production of a first layer as sealing layer is applied to the substrate and the formulation has at least one monomer, oligomer or prepolymer having at least one crosslinkable functional group. Subsequently, the first layer is cured and a second layer is applied at least to regions of the first layer, wherein the second layer has a coherent surface in the printed regions. Further, a printed product having a substrate, a first layer and a second layer, wherein the first layer and the second layer comprise an organic crosslinked lacquer and have a coherent surface, and wherein the first layer is transparent and has a layer thickness in the range from 1 to 10 μm. The second layer has been applied at least to regions of the first layer, such that the first layer is disposed between the substrate and the second layer.

A method of manufacturing an embossing element for decorative surfaces includes the steps of: a) UV curable inkjet printing a decorative pattern on a metallic surface; and b) forming a relief by etching metal from the metallic surface.

A method of manufacturing an embossing element for decorative surfaces includes the steps of: a) UV curable inkjet printing a decorative pattern on a metallic surface; and b) forming a relief by etching metal from the metallic surface.

The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.

The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.

The present invention provides a powder of spherical particles of crosslinkable polyamide suitable for the technique of selective laser sintering (SLS), and also a process for the production of such a powder of spherical particles of crosslinkable polyamide. The present invention also provides the production of articles by SLS, followed by a crosslinking step, starting from said powder of spherical particles of crosslinkable polyamide.

The present invention provides a powder of spherical particles of crosslinkable polyamide suitable for the technique of selective laser sintering (SLS), and also a process for the production of such a powder of spherical particles of crosslinkable polyamide. The present invention also provides the production of articles by SLS, followed by a crosslinking step, starting from said powder of spherical particles of crosslinkable polyamide.