Disclosed is an ink composition for photo-curable ink jet printing, comprising (A) at least one selected from the group consisting of hexanediol acrylate, 3-methyl-1,5-pentanediol diacrylate, dipropylene glycol diacrylate, and hydroxy pivalic acid neopentyl glycol diacrylate, (B) at least one of vinyl amide monomer and acryloyl amine monomer, (C) an acrylated amine compound having two photopolymerizable functional groups and two amino groups in a molecule, (D) a monofunctional monomer (excluding vinyl amide monomer which is the (B) component), and a photopolymerization initiator, wherein a content of the (A) component is 40 to 70% by mass, wherein a content of the (B) component is 5 to 30% by mass, wherein a content of the (C) component is 0.1 to 15% by mass, and wherein a viscosity is 200 mPa.Math.s or less.

An actinic ray-curable-type inkjet ink composition for 3D printing includes an acrylate monomer A capable of forming a homopolymer having a glass transition temperature of from 25° C. to 120° C.; an acrylate monomer B capable of forming a homopolymer having a glass transition temperature of −60° or higher and lower than 25° C.; a bifunctional acrylate oligomer C having a weight-average molecular weight of from 2,000 to 20,000; and an acylphosphine oxide compound, in which the mass content of bifunctional or higher-functional acrylate compounds is 15% by mass or less.

An actinic ray-curable-type inkjet ink composition for 3D printing includes an acrylate monomer A capable of forming a homopolymer having a glass transition temperature of from 25° C. to 120° C.; an acrylate monomer B capable of forming a homopolymer having a glass transition temperature of −60° or higher and lower than 25° C.; a bifunctional acrylate oligomer C having a weight-average molecular weight of from 2,000 to 20,000; and an acylphosphine oxide compound, in which the mass content of bifunctional or higher-functional acrylate compounds is 15% by mass or less.

An ultraviolet curable composition includes a polymerizable compound and is stored in a storage body, in which an amount of water is greater than or equal to 0.05 mass % and less than or equal to 1.0 mass % with respect to a total amount of the ultraviolet curable composition, a content of at least one metal element selected from a group consisting of Li, Na, K, Ag, Mg, Ca, Ba, Zn, Fe, Sn, Al, and Zr is greater than or equal to 10 ppm by mass, and a content of each metal element included in the group is less than or equal to 250 ppm by mass.

An ultraviolet curable composition includes a polymerizable compound and is stored in a storage body, in which an amount of water is greater than or equal to 0.05 mass % and less than or equal to 1.0 mass % with respect to a total amount of the ultraviolet curable composition, a content of at least one metal element selected from a group consisting of Li, Na, K, Ag, Mg, Ca, Ba, Zn, Fe, Sn, Al, and Zr is greater than or equal to 10 ppm by mass, and a content of each metal element included in the group is less than or equal to 250 ppm by mass.

An object of the present invention is to provide an active energy ray-curable lithographic ink that exhibits good adhesion to a plastic film and does not cause a decrease in the adhesion capability even during hot-water treatment. The present invention encompasses an active energy ray-curable lithographic ink containing (a) a polyurethane and (b) a polymerizable monomer.

An object of the present invention is to provide an active energy ray-curable lithographic ink that exhibits good adhesion to a plastic film and does not cause a decrease in the adhesion capability even during hot-water treatment. The present invention encompasses an active energy ray-curable lithographic ink containing (a) a polyurethane and (b) a polymerizable monomer.

A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.

In one aspect, inks for use with a three-dimensional (3D) printing system are described herein. In some embodiments, an ink described herein comprise 10-70 wt. % or 20-40 wt. % of a cyclopolymerizable monomer, based on the total weight of the ink. The cyclopolymerizable monomer comprises an acrylate moiety and an ethenyl or ethynyl moiety, and the α-carbon of the acrylate moiety and the α-carbon of the ethenyl or ethynyl moiety may have a 1,5-, 1,6-, 1,7-, or 1,8-relationship. Additionally, an ink described herein can have a viscosity of 1600 centipoise (cP) or less at 30° C., or of 500 cP or less at 30° C. and can be used to print a desired 3D article having mechanical properties similar to those of articles formed from thermoplastic materials.

In one aspect, inks for use with a three-dimensional (3D) printing system are described herein. In some embodiments, an ink described herein comprise 10-70 wt. % or 20-40 wt. % of a cyclopolymerizable monomer, based on the total weight of the ink. The cyclopolymerizable monomer comprises an acrylate moiety and an ethenyl or ethynyl moiety, and the α-carbon of the acrylate moiety and the α-carbon of the ethenyl or ethynyl moiety may have a 1,5-, 1,6-, 1,7-, or 1,8-relationship. Additionally, an ink described herein can have a viscosity of 1600 centipoise (cP) or less at 30° C., or of 500 cP or less at 30° C. and can be used to print a desired 3D article having mechanical properties similar to those of articles formed from thermoplastic materials.