Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a first oligomer comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the first oligomer comprises a polyepoxide based on Bisphenol A, F, or S, a polyepoxide based on hydrogenated Bisphenol A, F, or S, a polycarbonate, or a polyimide. The composition may further comprise a second network-forming component.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a first oligomer comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the first oligomer comprises a polyepoxide based on Bisphenol A, F, or S, a polyepoxide based on hydrogenated Bisphenol A, F, or S, a polycarbonate, or a polyimide. The composition may further comprise a second network-forming component.

The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.

The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.

The invention relates to a marking composition, by means of which better protection of goods than hitherto available can be achieved independently of the coloring of the goods. The marking composition comprises an infrared-absorbing particulate component and carbon derivative, wherein the weight ratio of infrared-absorbing component to carbon derivative is in the range of approx. 10:1 to approx. 10,000:1.

The invention relates to a marking composition, by means of which better protection of goods than hitherto available can be achieved independently of the coloring of the goods. The marking composition comprises an infrared-absorbing particulate component and carbon derivative, wherein the weight ratio of infrared-absorbing component to carbon derivative is in the range of approx. 10:1 to approx. 10,000:1.

Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.

Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.

In various embodiments, a resin composition includes a urethane (meth)acrylate, a reactive diluent, and a urethane (meth)acrylate toughener. The urethane (meth)acrylate toughener includes at least one additional polyol having a number average molecular weight Mn of greater than 1,000 g/mol. Cured articles made from the resin composition have an average fracture toughness (K.sub.Ic) value from 1 MPa*m.sup.1/2 to 3 MPa*m.sup.1/2 when measured in accordance with ASTM D5045. Processes for making the resin composition as well as processes using the resin composition are also provided.

In various embodiments, a resin composition includes a urethane (meth)acrylate, a reactive diluent, and a urethane (meth)acrylate toughener. The urethane (meth)acrylate toughener includes at least one additional polyol having a number average molecular weight Mn of greater than 1,000 g/mol. Cured articles made from the resin composition have an average fracture toughness (K.sub.Ic) value from 1 MPa*m.sup.1/2 to 3 MPa*m.sup.1/2 when measured in accordance with ASTM D5045. Processes for making the resin composition as well as processes using the resin composition are also provided.