A coating layer application device (200) for applying a coating layer, which is located on a transfer element, to a substrate, the coating layer (206) being formed from a coating material, in particular a thermosetting coating material, the coating layer (206) being curable and comprising an amorphous material, the coating layer application device comprising: a heating device (214, 220) being configured so as to (i) maintain the temperature of the coating layer (206) within a temperature range before removal of N the transfer element (204) from the coating layer (206), wherein within the temperature range the uncured coating material is in its supercooled liquid state; and/or (ii) partially cure the coating layer (206) during a contact of the coating layer (206) and the substrate (210) and before removal of the transfer element (204) from the coating layer, in particular by increasing the temperature of the coating layer (206) to a temperature at or above a curing temperature of the coating layer (206).

An ink contains at least one kind of polyether-modified siloxane compound and at least one kind of aliphatic alcohol alkylene oxide compound.

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

A formulation for preparing organic electronic devices, has: a p-type organic semiconductor polymer including a conjugated aryl polymer, a conjugated heteroaryl compound, or a mixture of at least two of these compounds; an n-type semiconductor material including fullerene, substituted fullerene, or a mixture of at least two of these compounds; and a non-aqueous solvent. The concentration of the p-type organic semiconductor polymer is in the range from 4 mg/mL to 8 mg/mL per milliliter of solvent and the concentration of the p-type organic semiconductor material is in the range from 10 mg/mL to 14 mg/mL per milliliter of solvent.

A formulation for preparing organic electronic devices, has: a p-type organic semiconductor polymer including a conjugated aryl polymer, a conjugated heteroaryl compound, or a mixture of at least two of these compounds; an n-type semiconductor material including fullerene, substituted fullerene, or a mixture of at least two of these compounds; and a non-aqueous solvent. The concentration of the p-type organic semiconductor polymer is in the range from 4 mg/mL to 8 mg/mL per milliliter of solvent and the concentration of the p-type organic semiconductor material is in the range from 10 mg/mL to 14 mg/mL per milliliter of solvent.

A phosphonium-containing polyurethane composition can include an aqueous liquid vehicle including water, organic co-solvent, and surfactant, and polyurethane particles including a polyurethane polymer with a polyurethane backbone. The polyurethane polymer can have pendant side chain groups along the polyurethane backbone as well as end cap groups terminating the polyurethane polymer. The pendant side chain groups and the end cap groups can collectively include aliphatic phosphonium salts and polyalkylene oxides.

A phosphonium-containing polyurethane composition can include an aqueous liquid vehicle including water, organic co-solvent, and surfactant, and polyurethane particles including a polyurethane polymer with a polyurethane backbone. The polyurethane polymer can have pendant side chain groups along the polyurethane backbone as well as end cap groups terminating the polyurethane polymer. The pendant side chain groups and the end cap groups can collectively include aliphatic phosphonium salts and polyalkylene oxides.

A method includes applying a coating composition to a substrate through a high transfer efficiency applicator wherein the coating composition has a pH of greater than about 7 and comprises: A. a resin dispersion comprising a latex, a polyurethane, or combinations thereof; B. an optional cross-linker; C. an optional pigment; D. water; E. a water-soluble solvent; and F. at least one rheology control agent chosen from an alkali swellable emulsion, a layered silicate, and combinations thereof; wherein the coating composition has a viscosity of about 20 to about 100 cps as determined using ASTM 7867-13 with cone-and-plate or parallel plates at a shear rate of 1000 sec-1, and wherein the coating composition has a wet film thickness of at least 20 microns measured at about 45 degrees without visible sag.

A method includes applying a coating composition to a substrate through a high transfer efficiency applicator wherein the coating composition has a pH of greater than about 7 and comprises: A. a resin dispersion comprising a latex, a polyurethane, or combinations thereof; B. an optional cross-linker; C. an optional pigment; D. water; E. a water-soluble solvent; and F. at least one rheology control agent chosen from an alkali swellable emulsion, a layered silicate, and combinations thereof; wherein the coating composition has a viscosity of about 20 to about 100 cps as determined using ASTM 7867-13 with cone-and-plate or parallel plates at a shear rate of 1000 sec-1, and wherein the coating composition has a wet film thickness of at least 20 microns measured at about 45 degrees without visible sag.